Sub-100 μm snag solder bumping technology and the bump reliability

Journal of Electronic Packaging

Volumn 131, Issue 1, 2009, Pages 0110141-0110146

  Lin, Xiaoqin ^a,b   Luo, Le ^b  

^a UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^b INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

Reliability; SnAg; Solder bump

Indexed keywords

COPPER ALLOYS; ELECTRONICS PACKAGING; ELECTROPLATING; FLIP CHIP DEVICES; LEAD-FREE SOLDERS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; TIN ALLOYS; TITANIUM ALLOYS;

BUMPING PROCESS; CU UNDER BUMP METALLURGIES; ELECTRONIC PACKAGING INDUSTRY; INTERMETALLICS COMPOUNDS; MICRO VOIDS; MULTIPLE REFLOWS; SHEAR TESTS; SN-AG SOLDER; SOLDER BUMP; SOLDER BUMPING;

BINARY ALLOYS;

EID: 77955189541     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2957333     Document Type: Article

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