Reliability of interfaces for lead-free solder bumps

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 615-619

  Shih, Richard L H ^a   Lau, Danny Y K ^b   Kwok, Raymund W M ^b   Li, M ^a   Sun, Mandy K W ^a  

^a CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

^b Rohm and Haas Electronic Materials Asia Limited   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; AUGER ELECTRON SPECTROSCOPY; FAILURE ANALYSIS; FLIP CHIP DEVICES; INTERFACES (MATERIALS); INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLDERING ALLOYS; THERMAL CYCLING; TIN ALLOYS;

SCANNING AUGER MICROSCOPY (SAM); SOLDER BUMPING PROCESSES; UNDER BUMP METALS (UBM);

CHIP SCALE PACKAGES;

EID: 3843052377     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Mitchell, D. et al, "Methodology for studying the impact of intrinsic stress on the reliability of the Electroless Ni UBM structure", IEEE Trans-CPT, Vol. 24, No. 4 (2001), pp. 667-672.
2. Lin, K.L. et al, "Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si", IEEE Trans-CPT, Vol. 23, No. 4 (2000), pp. 657 - 660.
3. Tu, K.N. et al, "Physics and materials challenges for lead-free solders," J. Appl. Phy., Vol. 93, No. 3 (2003) pp. 1335- 1353.