Impact of shorting vias placement on embedded planar electromagnetic bandgap structures within multilayer printed circuit boards

IEEE Transactions on Microwave Theory and Techniques

Volumn 58, Issue 7 PART 1, 2010, Pages 1867-1876

  De Paulis, Francesco ^a   Raimondo, Leo ^a   Orlandi, Antonio ^a  

^a UNIVERSITY OF L'AQUILA   (Italy)

Author keywords

Electromagnetic bandgap (EBG); Embedded EBG; Power integrity; Via placement

Indexed keywords

BAND GAPS; ELECTROMAGNETIC BAND GAPS; ELECTROMAGNETIC BANDGAP STRUCTURES; MULTILAYER PRINTED CIRCUIT BOARD; PATTERNED LAYERS; POWER INTEGRITY; SOLID LAYERS;

ELECTROMAGNETISM; ENERGY GAP; MAGNETIC MATERIALS; METAMATERIALS; PRINTED CIRCUIT MANUFACTURE;

PRINTED CIRCUIT BOARDS;

EID: 77954657159     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2010.2050029     Document Type: Article

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