Multiband electromagnetic-bandgap structures for applications in small form-factor multichip module packages

IEEE Transactions on Microwave Theory and Techniques

Volumn 56, Issue 10, 2008, Pages 2293-2300

  Kamgaing, Telesphor ^a   Ramahi, Omar M ^b  

^a INTEL CORPORATION   (United States)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Artificial magnetic conductor; Electromagnetic bandgap (EBG) structures; Multichip packaging; Multilayer organic package substrate; Signal isolation

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; CHIP SCALE PACKAGES; COMMUNICATION SYSTEMS; ELECTROMAGNETISM; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; EMBEDDED SYSTEMS; ENERGY GAP; FLIP CHIP DEVICES; FREQUENCY BANDS; GLOBAL SYSTEM FOR MOBILE COMMUNICATIONS; INDUCTANCE; MAGNETIC MATERIALS; MOBILE COMPUTING; MULTICHIP MODULES; MULTILAYERS;

ARTIFICIAL MAGNETIC CONDUCTOR; BANDGAP; BANDGAP STRUCTURES; ELECTROMAGNETIC; ELECTROMAGNETIC SIMULATIONS; ELECTROMAGNETIC-BANDGAP (EBG) STRUCTURES; EXPERIMENTAL CHARACTERIZATIONS; EXTREMELY LOW FREQUENCIES; GRID ARRAYS; MICROPROCESSOR PACKAGING; MULTIBAND; MULTICHIP PACKAGING; ORGANIC; SAMPLE STRUCTURES; SIGNAL ISOLATION; UNIT CELLS; WIRELESS COMMUNICATION SYSTEMS;

ELECTROMAGNETIC WAVES;

EID: 54049101550     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2008.2003525     Document Type: Article

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