Design, modeling, and characterization of embedded electromagnetic band gap (EBG) structure

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2008, Pages 83-86

  Huh, Suzanne ^a   Swaminathan, Madhavan ^a   Muradali, Fidel ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALOG-TO-DIGITAL CONVERTERS; DESIGN TECHNIQUES; EBG STRUCTURES; ELECTROMAGNETIC BAND GAPS; EXPERIMENTAL VEHICLES; NOISE ISOLATIONS; NOISE PROPAGATIONS; SIMULATION AND MEASUREMENTS; SIMULATION RESULTS;

ELECTRIC SIGNAL SYSTEMS; ENERGY GAP; GALLIUM ALLOYS; MULTICARRIER MODULATION; SIGNAL SYSTEMS;

ELECTRONICS PACKAGING;

EID: 58049112185     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2008.4675883     Document Type: Conference Paper

References (4)

1. J. Choi, V. Govind, and M. Swaminathan, "A novel Electromagnetic Band Gap (EBG) structure for mixed-signal system applications," IEEE Radio and Wireless Conference, pp. 243 - 246, September 2004
2. T. Kim, et al., "A Novel Synthesis Method for Designing Electromagnetic Band Gap (EBG) Structures in Packaged Mixed Signal Systems," Electronic Components and Technology Conference, pp. 1645-1651, June 2006
3. T. Kamgaing and O. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface," IEEE Microwave and Guided Wave Letters, vol. 13, no. 1, January 2003
4. D. Sievenpiper, et al., "High-impedance electromagnetic surfaces with a forbidden frequency band," IEEE Trans. Microwave Theory and Techniques, vol. 47, No. 11, Nov. 1999, pp. 2059-2074