Novel electroless copper deposition on carbon fibers with environmentally friendly processes

Journal of Colloid and Interface Science

Volumn 348, Issue 2, 2010, Pages 649-653

  Byeon, Jeong Hoon ^a   Kim, Jang Woo ^b  

^a SAMSUNG Electronics   (South Korea)

^b Hoseo University   (South Korea)

Author keywords

Carbon fiber (CF); Electroless copper deposition; Environmentally friendly process; Nonformaldehyde ELD; Silver (Ag) aerosol activation

Indexed keywords

AEROSOL NANOPARTICLE; ELECTROLESS COPPER DEPOSITION; ELECTROLESS DEPOSITION; ENVIRONMENTALLY FRIENDLY PROCESS; GRAIN SIZE; MASS DEPOSITION RATE; NITROGEN ATMOSPHERES; NONFORMALDEHYDE ELD; PORE VOLUME;

ATMOSPHERIC AEROSOLS; CARBON FIBERS; COPPER; DEPOSITION; ELECTROLESS PLATING; FIBERS;

SILVER;

CARBON FIBER; COPPER; NANOPARTICLE; NITROGEN; SILVER;

AEROSOL; ARTICLE; CATALYSIS; CONTROLLED STUDY; MATERIAL COATING; PARTICLE SIZE; POROSITY; PRIORITY JOURNAL; SURFACE AREA; SURFACE PROPERTY;

EID: 77953913917     PISSN: 00219797     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jcis.2010.05.008     Document Type: Article

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