Wetting characteristics on hierarchical structures patterned by a femtosecond laser

Journal of Micromechanics and Microengineering

Volumn 20, Issue 7, 2010, Pages

  Zhang, Dongshi ^a   Chen, Feng ^a   Fang, Guoping ^a   Yang, Qing ^a   Xie, Degang ^a   Qiao, Guanjun ^a   Li, Wen ^b   Si, Jinhai ^a   Hou, Xun ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b NANCHANG HANGKONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE FORCE; ANISOTROPIC SURFACES; DYNAMIC WETTING; EVAPORATION PROCESS; FEMTO-SECOND LASER; FEMTOSECOND LASER IRRADIATION; GROOVE SPACINGS; HIERARCHICAL STRUCTURES; MICRO-SCALES; STRUCTURED SURFACES; TRIANGLE PATTERN; VERTEX ANGLE; WATER DROPLETS; WETTING CHARACTERISTICS; WETTING PROPERTY;

ANISOTROPY; DROP FORMATION; PULSED LASER APPLICATIONS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; ULTRASHORT PULSES; WETTING;

SURFACE MORPHOLOGY;

EID: 77953883383     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/7/075029     Document Type: Article

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