High throughput low coo industrial laser drilling tool

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference

Volumn , Issue , 2008, Pages 110-115

  Rodin, Alexey M ^a   Callaghan, Joseph ^a   Brennan, Niall ^a  

^a Silverstone House   (Ireland)

Author keywords

Laser micromachining; Percussion laser drilling; Tapered silicon via; Through silicon interconnects; TSV

Indexed keywords

INTERCONNECT APPLICATIONS; LASER DRILLING; LASER MICRO-MACHINING; MICRO RAMAN SPECTROSCOPY; PERCUSSION DRILLING; SILICON VIA; TEMPERATURE VARIATION; TSV;

COPPER PLATING; EXHIBITIONS; OPTIMIZATION; RAMAN SPECTROSCOPY; SILICON; THROUGHPUT;

SILICON WAFERS;

EID: 84877261860     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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