Determination of temperature change inside IC packages during laser ablation of molding compound

Microelectronics Reliability

Volumn 48, Issue 8-9, 2008, Pages 1263-1267

  Schwindenhammer, P ^a   Murray, H ^a   Descamps, P ^a   Poirier, P ^a  

^a LABORATOIRE CRISMAT   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ABLATION; ARSENIC COMPOUNDS; CHLORINE COMPOUNDS; FORMING; LASER ABLATION; LASERS; MOLDING; PULSED LASER DEPOSITION; QUALITY ASSURANCE; RELIABILITY; SAFETY FACTOR;

CHEMICAL-; DE-CAPSULATION; ELECTRONIC PACKAGING; IC PACKAGING; IN-SITU; LASER DECAPSULATION; LEAD FRAMES; MOLDING COMPOUND; REAL TIME; REGIONS OF INTEREST; TEMPERATURE CHANGING;

FAILURE ANALYSIS;

EID: 50249178595     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.07.044     Document Type: Article

References (7)

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