Thermal simulation of defect localisation using lock-in thermography in complex and fully packaged devices

2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Volumn , Issue , 2009, Pages

  Schmidt, Christian ^a   Falk, Naumann ^a   Altmann, Frank ^a   Martens, Stefan ^b  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

INTERNAL CIRCUITRY; LOCALISATION; LOCKIN THERMOGRAPHY; MANUFACTURING YIELD; PACKAGED DEVICE; THERMAL SIMULATIONS;

MICROELECTRONICS; MICROSYSTEMS; QUALITY ASSURANCE; REMOTE SENSING; SAFETY FACTOR;

FAILURE ANALYSIS;

EID: 67650514589     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2009.4938441     Document Type: Conference Paper

References (7)

1. Schmidt, C., et al., "Application of Lock-in- Thermography for 3d defect localisation in defect devices" Proc 2nd Electronics System-Integration Technology Conference, London, UK, September 2008, 1041-44
2. Winkler S., Advanced IC Packaging, Electronic Trend Publications Inc., 2007 Edition, San Jose, 2007
3. International Technology Roadmap for Semiconductors (ITRS), SiP White Paper - System Level Integration in the package, V9.0, 2008
4. Breitenstein O., Langenkamp M., Altmann F., Katzer D., Lindner A., Eggers E., Microscopic lock in thermography investigation of leakage sites in integrated circuits, Rev. of Scientific Instruments, 71 (2000), 4155-4160
5. th International Symposium for Testing and Failure Analysis ISTFA 2004, 595-599
6. Breitenstein O., Altmann F., Riediger T., Karg D., Lock-in IR Microscopy with 1.4 ?m Resolution by Using a Solid Immersion Lens, Electronic Device Failure Analysis, Volume 8 (2006), Issue 2, 4-13 (Pubitemid 44970109)
7. von Allmen M., Blatter A., Laser-Beam Interactions with Materials - Physical Principles and Applications, Second Edition, Springer, 1995