Pulsed laser ablation of IC packages for the device failure analyses

Proceedings of SPIE-The International Society for Optical Engineering

Volumn 4637, Issue , 2002, Pages 445-452

  Hong, M H ^a   Mai, Z H ^a   Chen, G X ^a   Thiam, T ^a   Song, W D ^a   Lu, Y F ^a   Soh, C E ^a   Chong, T C ^a  

^a DATA STORAGE INSTITUTE   (Singapore)

Author keywords

Laser ablation; Mold compounds and device failure analyses; Steam assistance

Indexed keywords

ELECTRONICS PACKAGING; FAILURE ANALYSIS; LASER ABLATION; LASER PULSES; NEODYMIUM LASERS;

DEVICE FAILURE ANALYSIS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0036405308     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.470669     Document Type: Article

References (17)

1. M.T. Goosey, Eds., Plastics for Electronics (Elsevier, London, 1985).
2. Norman G. Einspruch, Eds., VLSI Electronics Microstructure Science, Vol. 9 (Academic, New York, 1985).
3. C.Y. Chang and S.M. Sze, Eds., ULSI Technology (McGraw-Hill, New York, 1996).
4. Lawrence C. Wagner, Eds., Failure analysis of integrated circuits: tools and techniques (Kluwer Academic Publishers, 1999).
5. R.K. Singh and J. Narayan, Physics Review B. 41, 8843 (1990).
6. J.H. Brannon, Circuits and Devices, Sept., 19 (1990).
7. Y.F. Lu, W.D. Song, M.H. Hong, T.C. Chong and T.S. Low, J. Appl. Phys. 80, 499 (1996).
8. A.V. Pakhomov, W. Nichols and J. Borysow, Appl. Spec. 50, 880 (1996).
9. B. Luk'yanchuk, N. Bityurin, S. Anisimov, N. Arnold and D. Bauerle, Appl. Phys. A, 62, 397 (1996).
10. H. Schmidt, J. Ihlemann, B. Wolff-Rottke, K. Luther and J. Troe, J. Appl. Phys., 83, 5458 (1998).
11. G.H. Pettit, M.N. Ediger, D.W. Hahn, B.E. Brison and R. Sauerbrey, Appl. Phys. A, 58, 373 (1994).
12. R. Zecber, Plastics Engineering June, 35 (1985).
13. Y.F. Lu, M.H. Hong, D.S.H. Chan and T.S. Low, Mat. Res. Soc. Proc. 397, 323 (1996).
14. S. Zhu, Y.F. Lu, M.H. Hong and X.Y. Chen, J. Appl. Phys. 89, 2400 (2001).
15. Y.F. Lu, M.H. Hong and T.S. Low, J. Appl. Phys., 85, 2899 (1999).
16. W.P. Leung and A.C. Tam, Appl. Phys. Lett., 60, 23 (1992).
17. M.H. Hong, Y.F. Lu, W.D. Song, D.M. Liu and T.S. Low, SPIE Vol. 3184, 148 (1997).