Methods to explore and prevent pattern collapse in thin film lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7639, Issue , 2010, Pages

  Noga, David E ^a   Yeh, Wei Ming ^a   Lawson, Richard A ^a   Tolbert, Laren M ^b   Henderson, Clifford L ^a  

^a Georgia Institute of Technology   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Pattern collapse; photoresist surface crosslinking; reactive rinse

Indexed keywords

32-NM NODE; ADHESION FAILURES; BEFORE AND AFTER; CARBODIIMIDE CHEMISTRY; CRITICAL ISSUES; CROSSLINKED; DICARBOXYLIC ACID; HYDROXYSTYRENE; INTEGRATED CIRCUIT FABRICATION; LINE EDGE ROUGHNESS; PATTERN COLLAPSE; PHOTORESIST SURFACES; POSITIVE-TONE RESISTS; POST-DEVELOPMENT; PRINTING CAPABILITIES; SEM ANALYSIS; SPACE WIDTH;

CROSSLINKING; FUNCTIONAL GROUPS; STRATEGIC PLANNING; SURFACES;

PHOTORESISTS;

EID: 77953483367     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.848423     Document Type: Conference Paper

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