Silicide-based release of high aspect-ratio microstructures

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2010, Pages 120-123

  Hung, Li Wen ^a   Nguyen, Clark T C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ETCH HOLE; HIGH ASPECT RATIO; LATERAL DIMENSION; RELEASE METHODS; SACRIFICIAL LAYER; SILICIDATION; VOLUME SHRINKAGE;

CHEMICAL ELEMENTS; MECHANICAL ENGINEERING; MECHANICS; MICROSTRUCTURE; REACTIVE ION ETCHING; SILICIDES; SURFACE REACTIONS;

ASPECT RATIO;

EID: 77952779010     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2010.5442550     Document Type: Conference Paper

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