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Volumn 48, Issue 9 Part 1, 2009, Pages 0950021-0950028

Integration of self-assembled porous silica in low-k/Cu damascene interconnects

Author keywords

[No Author keywords available]

Indexed keywords

CU ELECTROPLATING; DAMAGED LAYERS; DAMASCENE INTERCONNECTS; DAMASCENE STRUCTURE; DIELECTRIC CONSTANTS; EFFECTIVE DIELECTRIC CONSTANTS; INDUCED DAMAGE; INTEGRATION PROCESS; LATERAL DIMENSION; METHYL GROUP; POROUS SILICA; POROUS SILICA FILMS; SELF-ASSEMBLED; SILANOL GROUPS;

EID: 77952694515     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.48.095002     Document Type: Article
Times cited : (1)

References (20)
  • 19
    • 77952717346 scopus 로고    scopus 로고
    • JIS: JSK K 5600-5-6 (1999) [in Japanese]
    • JIS: JSK K 5600-5-6 (1999) [in Japanese].


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.