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Volumn 48, Issue 9 Part 1, 2009, Pages 0950021-0950028
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Integration of self-assembled porous silica in low-k/Cu damascene interconnects
a a a a b a a b a a b a c |
Author keywords
[No Author keywords available]
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Indexed keywords
CU ELECTROPLATING;
DAMAGED LAYERS;
DAMASCENE INTERCONNECTS;
DAMASCENE STRUCTURE;
DIELECTRIC CONSTANTS;
EFFECTIVE DIELECTRIC CONSTANTS;
INDUCED DAMAGE;
INTEGRATION PROCESS;
LATERAL DIMENSION;
METHYL GROUP;
POROUS SILICA;
POROUS SILICA FILMS;
SELF-ASSEMBLED;
SILANOL GROUPS;
HYDROCARBONS;
PERMITTIVITY;
PLASMA ETCHING;
SILICA;
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EID: 77952694515
PISSN: 00214922
EISSN: 13474065
Source Type: Journal
DOI: 10.1143/JJAP.48.095002 Document Type: Article |
Times cited : (1)
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References (20)
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