Interaction of scaling trends in processor architecture and cooling

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2010, Pages 198-204

  Huang, Wei ^a,b   Stan, Mircea R ^a   Gurumurthi, Sudhanva ^a   Ribando, Robert J ^a   Skadron, Kevin ^a  

^a University of Virginia   (United States)

^b IBM AUSTIN RESEARCH LABORATORY   (United States)

Author keywords

3d integration; Cooling solution; Manycore architecture; Processors; Technology scaling

Indexed keywords

3-D INTEGRATION; AIR COOLING; CHIP MULTIPROCESSOR; COOLING METHODS; COOLING SOLUTIONS; DESIGN POINTS; HEAT REMOVAL; MANY-CORE; MANY-CORE ARCHITECTURE; POWER CONSUMPTION; PROCESSOR ARCHITECTURES; SCALING TRENDS; SEMICONDUCTOR TECHNOLOGY; TECHNOLOGY SCALING;

COOLING; DESIGN; MICROPROCESSOR CHIPS; SEMICONDUCTOR DEVICE MANUFACTURE; TECHNOLOGY; THERMAL VARIABLES MEASUREMENT; THREE DIMENSIONAL;

COMPUTER ARCHITECTURE;

EID: 77952616529     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2010.5444290     Document Type: Conference Paper

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