Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

Microsystem Technologies

Volumn 16, Issue 4, 2010, Pages 633-639

  Cong, Yue ^a   Zhang, Yan ^a   Hu, Zhili ^a   Liu, Johan ^a,b   Cheng, Zhaonian ^a  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVE; EFFECTIVE THERMAL CONDUCTIVITY; MATRIX; MODEL-BASED SIMULATIONS; RELATIVE RADIUS; RESISTOR NETWORK; THERMAL PROPERTIES; TWO PHASE COMPOSITES;

COMPOSITE MATERIALS; COMPOSITE MICROMECHANICS; COMPUTER SIMULATION; FILLERS; RESISTORS; THERMAL CONDUCTIVITY; THERMOANALYSIS; THERMODYNAMIC PROPERTIES;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 77952545612     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-009-0984-1     Document Type: Article

References (23)

1. Agari Y, Ueda A, Tanaka M, Nagai S (1990) Thermal conductivity of a polymer filled with particles in the wide range from low to super-high volume content. J Appl Polym Sci 40:929-941. doi: 10.1002/app.1990.070400526
2. Boudenne A et al (2005) Electrical and thermal behavior of polypropylene filled with copper particles. Compos Part A Appl Sci Manuf 36:1545-1554. doi:10.1016/j.compositesa.2005.02.005
3. Bruggeman DAG (1935) The prediction of the thermal conductivity of heterogeneous mixtures. Ann Phys 24:636-664. doi:10.1002/ andp.19354160705
4. Campbell RC, Smith SE, Dietz RL (1999) Measurements of adhesive bondline effective thermal conductivity and thermal resistance using the laser flash method. In: 15th IEEE SEMl-THERMTM symposium, San Diego, USA, pp 83-97. doi:10.1109/STHERM. 1999.762433
5. Culham JR, Teertstra P, Savija I, Yovanovich MM (2002) Design, assembly and commissioning of a test apparatus for characterizing thermal interface materials. In: ITHERM conference, pp 128-135. doi:10.1109/ITHERM.2002.1012448
6. Davis LC, Artz BE (1995) Thermal conductivity of metal-matrix composites. J Appl Phys 77(10):4860-4954. doi:10.1063/1.359302
7. Devpura A, Phelan PE, Prasher R (2000) Percolation theory applied to the analysis of thermal interface materials in flip-chip technology. In: ITHERM conference 1:21-28. doi:10.1109/ITHERM. 2000.866803
8. Falat T et al (2007) Influence of matrix viscoelastic properties on thermal conductivity of TCA-Numerical approach. Microelectron Reliab 47:1989-1996. doi:10.1016/j.microrel.2007.04.010
9. Ganapathy D, Singh K, Phelan PE, Prasher R (2005) An effective unit cell approach to compute the thermal conductivity of composites with cylindrical particles. J Heat Transf 127(6):553-559. doi: 10.1115/1.1915387
10. Graebner JE et al (1998) Report on a second round robin measurement of the thermal conductivity of CVD diamond. Diam Relat Mater 7(11):1589-1604. doi:10.1016/S0925-9635(98)00241-6
11. Inoue M et al (2009) Physical factors determining thermal conductivities of isotropic conductive adhesives. J Electron Mater 38(3):430-437. doi:10.1007/s11664-008-0593-2
12. John H, Lienhard IV, John H, Lienhard V (2002) A heat transfer textbook, 3rd edn. Phlogiston Press, Cambridge
13. Kimura T, Goto T (2005) Thermal conductivities of yttria-stabilized zirconia films measured by a laser-heating AC method. Surf Coat Technol 198:129-132. doi:10.1016/j.surfcoat.2004.10.027
14. Lu DQ, Tong QK, Wong CP (1999) Conductivity mechanisms of isotropic conductive adhesives (ICA's). J IEEE Trans Electron Packag Manuf 22(3):223-227. doi:10.1109/6104.795857
15. Maxwell JC (1954) A treatise on electricity and magnetism. Dover, New York
16. Nielsen LE (1974) The thermal and electrical conductivity of twophase systems. Ind Eng Chem Fundam 13(1):17-20. doi: 10.1021/i160049a004
17. Prasher R (2006) Thermal interface materials: historical perspective, status, and future directions. Proc IEEE 94(8):1571-1586. doi: 10.1109/JPROC.2006.879796
18. Sabry MN (2003) Compact thermal models for electronic systems. IEEE Trans Compon Packag Tech 26(1):179-185. doi: 10.1109/TCAPT.2002.808009
19. Su B, Qu JM (2004) A micromechanics model for electrical conduction in isotropically conductive adhesives during curing. In: 9th international symposium on advanced packaging materials, pp 145-151. doi:10.1109/ISAPM.2004. 1288005
20. Wang JJ, Yi XS (2003) Preparation and the properties of PMR-type polyimide composites with aluminum nitride. J Appl Polym Sci 89:3913-3917. doi:10.1002/app.12618
21. Wang JJ, Yi XS (2004) Effects of interfacial thermal barrier resistance and particle shape and size on the thermal conductivity of AIN/PI composites. Compos Sci Technol 64(10-11):1623-1628. doi:10.1016/j.compscitech.2003.11.007
22. Yue C, Zhang Y, Liu JJ, Cheng ZN, Fan JY (2008) Numerical investigation on the effect of filler distribution on effective thermal conductivity of thermal interface material. In: ICEPTHDP 2008 conference, Shanghai, China, pp 1-5. doi: 10.1109/ICEPT.2008.4606971
23. Yue C, Zhang Y, Liu JJ, Inoue M, Jiang SJ, Cheng ZN (2009) Influences of filler geometry and content on effective thermal conductivity of thermal conductive adhesive. In: ECTC conference, San Diego, USA, pp 2055-2059. doi:10.1109/ECTC. 2009.5074306