Numerical investigation on the effect of filler distribution on effective thermal conductivity of thermal interface material

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Yue, Cong ^a   Zhang, Yan ^a   Liu, Johan ^a,b   Cheng, Zhaonian ^b   Fan, Jing Yu ^a  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON FIBER REINFORCED PLASTICS; COMPUTER SIMULATION; CONDUCTIVE MATERIALS; ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; FILLERS; FINITE ELEMENT METHOD; LOADING; TECHNOLOGY; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOELECTRICITY;

CELL MODELING; CONDUCTIVE PARTICLES; EFFECTIVE THERMAL CONDUCTIVITY; ELECTRONIC PACKAGING; ELECTRONICS SYSTEMS; EXPERIMENTAL DATA; FILLER DISTRIBUTION; FINITE-ELEMENT METHODS; HIGH-DENSITY PACKAGING; INTERFACE MATERIALS; INTERNATIONAL CONFERENCES; NUMERICAL INVESTIGATIONS; NUMERICAL SIMULATIONS; PARAMETERIZED; PARTICLE DISTRIBUTION PATTERNS; PARTICLE VOLUME; SIMULATION RESULTS; THERMAL MANAGEMENT; VOLUME PERCENTAGE;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 52449125889     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4606971     Document Type: Conference Paper

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