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Volumn , Issue , 2008, Pages
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Numerical investigation on the effect of filler distribution on effective thermal conductivity of thermal interface material
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Author keywords
[No Author keywords available]
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Indexed keywords
CARBON FIBER REINFORCED PLASTICS;
COMPUTER SIMULATION;
CONDUCTIVE MATERIALS;
ELECTRONIC EQUIPMENT;
ELECTRONICS PACKAGING;
FILLERS;
FINITE ELEMENT METHOD;
LOADING;
TECHNOLOGY;
THERMAL CONDUCTIVITY;
THERMAL INSULATING MATERIALS;
THERMOANALYSIS;
THERMODYNAMIC PROPERTIES;
THERMOELECTRICITY;
CELL MODELING;
CONDUCTIVE PARTICLES;
EFFECTIVE THERMAL CONDUCTIVITY;
ELECTRONIC PACKAGING;
ELECTRONICS SYSTEMS;
EXPERIMENTAL DATA;
FILLER DISTRIBUTION;
FINITE-ELEMENT METHODS;
HIGH-DENSITY PACKAGING;
INTERFACE MATERIALS;
INTERNATIONAL CONFERENCES;
NUMERICAL INVESTIGATIONS;
NUMERICAL SIMULATIONS;
PARAMETERIZED;
PARTICLE DISTRIBUTION PATTERNS;
PARTICLE VOLUME;
SIMULATION RESULTS;
THERMAL MANAGEMENT;
VOLUME PERCENTAGE;
THERMAL CONDUCTIVITY OF SOLIDS;
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EID: 52449125889
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ICEPT.2008.4606971 Document Type: Conference Paper |
Times cited : (4)
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References (10)
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