A micromechanics model for electrical conduction in isotropically conductive adhesives during curing

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 9, Issue , 2004, Pages 145-151

  Su, Bin ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; COMPUTER SIMULATION; CURING; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; EPOXY RESINS; FILLERS; FINITE ELEMENT METHOD; MICROSTRUCTURE; POLYMERS; SOLDERING ALLOYS;

CONTACT RESISTANCE; ISOTROPICALLY CONDUCTIVE ADHESIVES (ICA); MICROMECHANICS MODELS; POLYMER MATRIX;

ADHESIVES;

EID: 2442589677     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Liu, J., Conductive Adhesives for Electronics Packaging, Electrochemical Publications Ltd, (Port Erin, 1999), pp. 1-120.
2. Kirkpatrick, S., "Percolation and Conduction," Rev. Modern Phys., Vol. 45, No. 4 (1973), pp. 574-588.
3. Lu, D. and Wong, C.P., "Effects of Shrinkage on Conductivity of Isotropi Conductive Adhesives", Int. J. Adhesion and Adhesives, Vol. 20, No. 3 (2000), pp. 189-193.
4. Holm, R., Electric Contacts. Theory and Application, Springer-Verlag (New York, 1967), pp. 9-26, pp. 118-128.
5. Li, L. and Morris, J., "Electrical Conduction Models for Isotropically Conductive Adhesive Joints," IEEE Trans-CPMT-A, Vol., 20, No. 1 (1997), pp. 3-8.
6. Serra, J., Image Analysis and Mathematical Morphology, Academic Press, (London, 1988), pp. 30-50.
7. Louis, P. and Gokhale, A.M., "Computer Simulation of Spatial Arrangement and Connectivity of Particles in Three-Dimensional Microstructure: Application to Model Electrical Conductivity of Polymer Matrix Composite," Acta Mater., Vol. 44, No.4 (1996), pp. 1519-1528.