Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach

Microelectronics Reliability

Volumn 47, Issue 12, 2007, Pages 1989-1996

  Falat, Tomasz ^a   Wymysłowski, Artur ^a   Kolbe, Jana ^b   Jansen, Kaspar M B ^c   Ernst, Leo ^c  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b FRAUNHOFER INSTITUTE FOR MANUFACTURING TECHNOLOGY AND ADVANCED MATERIALS IFAM   (Germany)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FILLERS; MATHEMATICAL MODELS; NUMERICAL METHODS; THERMAL CONDUCTIVITY; VISCOELASTICITY;

FILLER PARTICLES; HEAT CONDUCTANCE; THERMALLY CONDUCTIVE ADHESIVES (TCA);

ADHESIVES;

EID: 35648965225     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.04.010     Document Type: Article

References (12)

1. Falat T, Felba J, Friedel K, Wymyslowski A. Simulation based approach to thermal contact properties assessment in modern electronic packages. In: Proceedings of 10th international conference mixed design of integrated circuits and systems, Łódź; 2003. p. 361-6.
2. Bin Su, Jianmin Qu. A micro-mechanics model for electrical conduction in isotropically conductive adhesives during curing. In: Proceedings of IEEE 2004 electronic components and technology conference; 2004. p. 1766-71.
3. Jansen KMB, Wang L, Yang DG, van't Hof C, Ernst LJ, Bressers HJL, et al. Constitutive modeling of moulding compounds. In: Proceedings of IEEE 2004 electronic components and technology conference, 2004. p. 890-4.
4. Yang DG, Jansen KMB, Ernst LJ, Zhang GQ, van Driel WD, Bressers HJL. Modeling of cure-induced warpage of plastic IC packages. In: Proceedings of 5th international conference on thermal and mechanical simulation and experiments in micro-electronics and micro-systems, EuroSimE2004. p. 33-7.
5. Jansen KMB, Wang L, van't Hof C, Ernst LJ, Bressers HJL, Zhang GQ. Cure, temperature and time dependent constitutive modeling of moulding compounds. In: Proceedings of 5th international conference on thermal and mechanical simulation and experiments in micro-electronics and micro-systems, EuroSimE2004. p. 581-5.
6. Meuwissen M.H.H., de Boer H.A., Steijvers H.L.A.H., Schreurs P.J.G., and Geers M.G.D. Residual stresses in micro-electronics induced by thermoset packaging materials during cure. Microelectron Reliab 44 (2004) 1985-1994
7. Xu Y., et al. Thermally conducting aluminum nitride polymer-matrix composites. Compos Part A: Appl Sci (2001) 1749-1757
8. Bolger JC. Prediction and measurement of thermal conductivity of diamond filled adhesives, IEEE Publication No. 0569-5503/92/000-0219; 1992.
9. Yasunari Ukita et al. Lead free die mount adhesive using silver nano-particles applied to power discrete package. In: Proceedings of IMAPS2004, Long Beach, USA; 2004.
10. Li H., Jacob K.I., and Wong C.P. An improvement of thermal conductivity of underfill materials for flip-chip packages. IEEE Trans Adv Pack 26 1 (2003)
11. Milosheva BV, Jansen KMB, Janssen JHJ, Bressers HJL, Ernst LJ. Viscoelastic characterization of fast curing moulding compounds, EuroSimE. In: 6th international conference on thermal, mechanical and multiphysics simulation and experiments in micro-electronics and micro-systems; 2005.
12. Fałat T, Wymysłowski K, Kolbe J. Numerical approach to characterization of thermally conductive adhesives, Polytronic2005. In: 5th international IEEE conference on polymers and adhesives in micro-electronics and photonics, Wroclaw, Poland; 2005.