Volume effect of shear fracture behavior of Sn3.0Ag0.5Cu/Cu lead-free solder joints

Jinshu Xuebao/ Acta Metallurgica Sinica

Volumn 46, Issue 3, 2010, Pages 366-371

  Tian, Yanhong ^a   Yang, Shihua ^a   Wang, Chunqing ^a   Wang, Xuelin ^a   Lin, Pengrong ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Intermetallic compound; Lead free solder joint; Shear fracture; Volume effect

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; FRACTURE; FRACTURE MECHANICS; INTERMETALLICS; RELIABILITY; SHEAR FLOW; SILVER ALLOYS; SOLDERED JOINTS; TERNARY ALLOYS; TIN ALLOYS;

DENDRITIC MORPHOLOGY; ELECTRONIC INTERCONNECTIONS; ELECTRONIC PACKAGE; INTERFACE REGIONS; LEAD-FREE SOLDER JOINT; MECHANICS BEHAVIOR; SHEAR FRACTURE; VOLUME EFFECT;

LEAD-FREE SOLDERS;

EID: 77951983289     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: 10.3724/SP.J.1037.2010.00366     Document Type: Article

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