Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste

Journal of Materials Science

Volumn 42, Issue 8, 2007, Pages 2574-2581

  Shih, Po Cheng ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; INTERFACES (MATERIALS); MICROSTRUCTURE; SHEAR DEFORMATION; SUBSTRATES; TIN ALLOYS;

INTERFACIAL MICROSTRUCTURE; JOINT FRACTURES; SHEAR BEHAVIOR; STRENGTH TESTING;

SOLDERED JOINTS;

EID: 34047106720     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-006-1294-y     Document Type: Article

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