-
1
-
-
0035715857
-
-
0163-1918
-
A. Shimizu, K. Hachimine, N. Ohki, M. Koguchi, Y. Nonaka, H. Sato, and F. Ootsuka, Tech. Dig.-Int. Electron Devices Meet. 0163-1918, 2001, 433.
-
Tech. Dig. - Int. Electron Devices Meet.
, vol.2001
, pp. 433
-
-
Shimizu, A.1
Hachimine, K.2
Ohki, N.3
Koguchi, M.4
Nonaka, Y.5
Sato, H.6
Ootsuka, F.7
-
2
-
-
21644452652
-
-
0163-1918
-
H. S. Yang, R. Malik, S. Narasimha, Y. Li, R. Divakaruni, P. Agnello, S. Allen, A. Antreasyan, J. C. C. Arnold, K. Bandy, Tech. Dig.-Int. Electron Devices Meet. 0163-1918, 2004, 1075.
-
Tech. Dig. - Int. Electron Devices Meet.
, vol.2004
, pp. 1075
-
-
Yang, H.S.1
Malik, R.2
Narasimha, S.3
Li, Y.4
Divakaruni, R.5
Agnello, P.6
Allen, S.7
Antreasyan, A.8
Arnold, J.C.C.9
Bandy, K.10
-
3
-
-
4544382132
-
-
0743-1562
-
C. H. Chen, T. L. Lee, T. H. Hou, C. L. Chen, C. C. Chen, J. W. Hsu, K. L. Cheng, Y. H. Chiu, H. J. Tao, Y. Jin, Dig. Tech. Pap.-Symp. VLSI Technol. 0743-1562, 2004, 56.
-
Dig. Tech. Pap. - Symp. VLSI Technol.
, vol.2004
, pp. 56
-
-
Chen, C.H.1
Lee, T.L.2
Hou, T.H.3
Chen, C.L.4
Chen, C.C.5
Hsu, J.W.6
Cheng, K.L.7
Chiu, Y.H.8
Tao, H.J.9
Jin, Y.10
-
5
-
-
33845877965
-
-
L. S. Adam, C. Chiu, M. Huang, X. Wang, Y. Wang, S. Singh, Y. Chen, H. Bu, and J. Wu, in International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2005, IEEE, pp. 139-142 (2005).
-
(2005)
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2005, IEEE
, pp. 139-142
-
-
Adam, L.S.1
Chiu, C.2
Huang, M.3
Wang, X.4
Wang, Y.5
Singh, S.6
Chen, Y.7
Bu, H.8
Wu, J.9
-
6
-
-
77951146673
-
-
0163-1918
-
T. Miyashita, T. Owada, A. Hatada, Y. Hayami, K. Ookoshi, T. Mori, H. Kurata, and T. Futatsugi, Tech. Dig.-Int. Electron Devices Meet. 0163-1918, 2008, 1.
-
Tech. Dig. - Int. Electron Devices Meet.
, vol.2008
, pp. 1
-
-
Miyashita, T.1
Owada, T.2
Hatada, A.3
Hayami, Y.4
Ookoshi, K.5
Mori, T.6
Kurata, H.7
Futatsugi, T.8
-
7
-
-
41149150847
-
-
0743-1562
-
C. Ortolland, P. Morin, C. Chaton, E. Mastromatteo, C. Populaire, S. Orain, F. Leverd, P. Stolk, F. Boeuf, and F. Arnaud, Dig. Tech. Pap.-Symp. VLSI Technol. 0743-1562, 2006, 78.
-
Dig. Tech. Pap. - Symp. VLSI Technol.
, vol.2006
, pp. 78
-
-
Ortolland, C.1
Morin, P.2
Chaton, C.3
Mastromatteo, E.4
Populaire, C.5
Orain, S.6
Leverd, F.7
Stolk, P.8
Boeuf, F.9
Arnaud, F.10
-
8
-
-
33646043420
-
-
0018-9383. 10.1109/TED.2006.872088
-
S. E. Thompson, G. Sun, Y. S. Choi, and T. Nishida, IEEE Trans. Electron Devices 0018-9383, 53, 1010 (2006). 10.1109/TED.2006.872088
-
(2006)
IEEE Trans. Electron Devices
, vol.53
, pp. 1010
-
-
Thompson, S.E.1
Sun, G.2
Choi, Y.S.3
Nishida, T.4
-
9
-
-
8344236776
-
-
0018-9383. 10.1109/TED.2004.836648
-
S. E. Thompson, M. Armstrong, C. Auth, M. Alavi, M. Buehler, R. Chau, S. Cea, T. Ghani, G. Glass, T. Hoffman, IEEE Trans. Electron Devices 0018-9383, 51, 1790 (2004). 10.1109/TED.2004.836648
-
(2004)
IEEE Trans. Electron Devices
, vol.51
, pp. 1790
-
-
Thompson, S.E.1
Armstrong, M.2
Auth, C.3
Alavi, M.4
Buehler, M.5
Chau, R.6
Cea, S.7
Ghani, T.8
Glass, G.9
Hoffman, T.10
-
11
-
-
0021510887
-
-
0013-4651. 10.1149/1.2115263
-
R. B. Fair, J. J. Wortman, and J. Liu, J. Electrochem. Soc. 0013-4651, 131, 2387 (1984). 10.1149/1.2115263
-
(1984)
J. Electrochem. Soc.
, vol.131
, pp. 2387
-
-
Fair, R.B.1
Wortman, J.J.2
Liu, J.3
-
12
-
-
0024718568
-
-
0021-4922. 10.1143/JJAP.28.1421
-
Y. Sasaki, K. Itoh, and T. Sei-ichi, Jpn. J. Appl. Phys., Part 1 0021-4922, 28, 1421 (1989). 10.1143/JJAP.28.1421
-
(1989)
Jpn. J. Appl. Phys., Part 1
, vol.28
, pp. 1421
-
-
Sasaki, Y.1
Itoh, K.2
Sei-Ichi, T.3
-
14
-
-
77951181407
-
-
U.S. Pat. 0,054,164 A1
-
X. Qi, U.S. Pat. 0,054,164 A1 (2005).
-
(2005)
-
-
Qi, X.1
-
15
-
-
33846969134
-
-
0003-6951. 10.1063/1.2450663
-
N. Kong, S. K. Banerjee, T. A. Kirichenko, S. G. H. Anderson, and M. C. Foisy, Appl. Phys. Lett. 0003-6951, 90, 062107 (2007). 10.1063/1.2450663
-
(2007)
Appl. Phys. Lett.
, vol.90
, pp. 062107
-
-
Kong, N.1
Banerjee, S.K.2
Kirichenko, T.A.3
Anderson, S.G.H.4
Foisy, M.C.5
|