Modal analysis of board-level electronic package

Microelectronic Engineering

Volumn 85, Issue 3, 2008, Pages 610-620

  Zhang, Bo ^a   Ding, Han ^a   Sheng, XinJun ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Board level electronic package; Drop test; Modal analysis; Modal assurance criterion; Modal parameters

Indexed keywords

DAMPING; MODAL ANALYSIS; PARAMETER ESTIMATION; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS;

BOARD LEVEL ELECTRONIC PACKAGES; DROP TESTS; MODAL ASSURANCE CRITERION; MODAL PARAMETERS;

ELECTRONICS PACKAGING;

EID: 39149120578     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.11.008     Document Type: Article

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