Fatigue life prediction for flip chip soldered joints based on creep stain model

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 29, Issue 10, 2008, Pages 53-56

  Sheng, Zhong ^a   Xue, Songbai ^a   Zhang, Liang ^a   Gao, Lili ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Creep stain; Fatigue life; Finite element method; Plastic stain

Indexed keywords

ABS RESINS; BRAZING; CREEP; FATIGUE OF MATERIALS; HYSTERESIS; MAGNETIC MATERIALS; PLASTIC DEFORMATION; PLASTICS; SOLDERED JOINTS;

CREEP STRAINS; CYCLIC LOADINGS; CYCLICAL VARIATIONS; EQUIVALENT PLASTIC STRAINS; FATIGUE LIFE; FATIGUE LIVES; FLIP CHIPS; INITIAL STAGES; PLASTIC STRAINS; SIMULATED RESULTS; STRESS STRAINS; UPPER SURFACES;

FINITE ELEMENT METHOD;

EID: 55949097395     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (15)

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