Die attach film application in multi die stack package

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 848-852

  Song, S N ^a   Tan, H H ^a   Ong, P L ^a  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DIES; PRODUCTIVITY; RHEOLOGY; SILICON WAFERS;

DICING DIE ATTACH FILM (DDAF); DIE ATTACH FILM (DAF); PACKAGE MINIATURIZATION; WAFER DICING;

ELECTRONICS PACKAGING;

EID: 33847311393     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. th International, Jul. 2004, pp. 74-77
2. J-STD-020C. Joint IPC/JEDEC Standard for Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface-Mount Devices, Jul 2004
3. Semiconductor Divison, Die Attach Materials -Technical Data Presentation, Hitachi Chemical Co., Ltd (Japan, 2005), pp.2-6
4. th Internatinal Conference on Microelectronics, Dec 2003, pp.365-368
5. John H. Lau et al, Electronic Manufacturing, with leadfree, halogen-free & conductive-adhesive materials. McGraw-Hill (New York, 2003), pp. 7.1-7.10.
6. th Electronic Components and Technology Conf, May. 2000, pp.1616-1622.
7. th International, Jul. 2004, pp. 68-73