Ni-B electroless plating as cap layer for Ag multi-level metallization

Materials Transactions

Volumn 43, Issue 7, 2002, Pages 1615-1620

  Tsujimura, Manabu ^a   Inoue, Hiroaki ^a   Ezawa, Hirokazu ^a   Miyata, Masahiro ^a   Ota, Masahiro ^a  

^a EBARA CORPORATION   (Japan)

Author keywords

Barrier material; Cap layer; Electroless plating; Nickel boron plating; Silver damascene interconnect

Indexed keywords

COPPER; DIFFUSION; ELECTRIC CONDUCTIVITY; ELECTRIC CONNECTORS; METALLIZING; NICKEL PLATING; PERMITTIVITY; SILVER;

DAMASCENE INTERCONNECTS;

ELECTROLESS PLATING;

EID: 0036631011     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.1615     Document Type: Article

References (3)