-
2
-
-
33845563686
-
Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards
-
A. E. Engin, K. Bharath, M. Swaminathan, M. Cases, B. Mutnury, N. Pham, D. N. de Araujo, and E. Matoglu, "Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards," in 56th Electron. Compon. Technol. Conf., 2006, pp. 1262-1267.
-
(2006)
56th Electron. Compon. Technol. Conf.
, pp. 1262-1267
-
-
Engin, A.E.1
Bharath, K.2
Swaminathan, M.3
Cases, M.4
Mutnury, B.5
Pham, N.6
De Araujo, D.N.7
Matoglu, E.8
-
3
-
-
33846021318
-
Application of the foldy-lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards
-
Jan.
-
C. J. Ong, D. Miller, L. Tsang, B. Wu, and C. C. Huang, "Application of the foldy-lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards," Microw. Opt. Technol. Lett., vol.49, no.1, pp. 225-231, Jan. 2007.
-
(2007)
Microw. Opt. Technol. Lett.
, vol.49
, Issue.1
, pp. 225-231
-
-
Ong, C.J.1
Miller, D.2
Tsang, L.3
Wu, B.4
Huang, C.C.5
-
4
-
-
58049089249
-
Efficient analysis for multilayer power ground planes with multiple vias and signal traces in an advanced electronic package
-
Oct.
-
Z. Z. Oo, X. C.Wei, E. X. Liu, E. P. Li, and L. W. Li, "Efficient analysis for multilayer power ground planes with multiple vias and signal traces in an advanced electronic package," Elect. Perform. Electron. Packag., pp. 95-98, Oct. 2008.
-
(2008)
Elect. Perform. Electron. Packag.
, pp. 95-98
-
-
Oo, Z.Z.1
Wei, X.C.2
Liu, E.X.3
Li, E.P.4
Li, L.W.5
-
5
-
-
54049085454
-
Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method
-
Aug.
-
X. C.Wei, E. P. Li, E. X. Liu, E. K. Chua, Z. Z. Oo, and R. Vahldieck, "Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method," IEEE Trans. Adv. Packag., vol.31, no.3, pp. 536-543, Aug. 2008.
-
(2008)
IEEE Trans. Adv. Packag.
, vol.31
, Issue.3
, pp. 536-543
-
-
Wei, X.C.1
Li, E.P.2
Liu, E.X.3
Chua, E.K.4
Oo, Z.Z.5
Vahldieck, R.6
-
6
-
-
51049117696
-
Efficient modeling of re-routed return currents in multilayered power-ground planes by using integral equation
-
Aug.
-
X. C. Wei, E. P. Li, E. X. Liu, and X. Cui, "Efficient modeling of re-routed return currents in multilayered power-ground planes by using integral equation," IEEE Trans. Electromagn. Compat., vol.50, no.3, pp. 740-743, Aug. 2008.
-
(2008)
IEEE Trans. Electromagn. Compat.
, vol.50
, Issue.3
, pp. 740-743
-
-
Wei, X.C.1
Li, E.P.2
Liu, E.X.3
Cui, X.4
-
7
-
-
54049098239
-
Efficient simulation of power distribution network by using integral equation and modal decoupling technology
-
Oct.
-
X. C. Wei, E. P. Li, E. X. Liu, and R. Vahldieck, "Efficient simulation of power distribution network by using integral equation and modal decoupling technology," IEEE Trans. Microw. Theory Tech., vol.56, no.10, pp. 2277-2285, Oct. 2008.
-
(2008)
IEEE Trans. Microw. Theory Tech.
, vol.56
, Issue.10
, pp. 2277-2285
-
-
Wei, X.C.1
Li, E.P.2
Liu, E.X.3
Vahldieck, R.4
-
8
-
-
33747610416
-
Modeling and measurement of simultaneous switching noise coupling through signal via transition
-
Aug.
-
J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam, and J. Kim, "Modeling and measurement of simultaneous switching noise coupling through signal via transition," IEEE Trans. Adv. Packag., vol.29, no.3, pp. 548-559, Aug. 2006.
-
(2006)
IEEE Trans. Adv. Packag.
, vol.29
, Issue.3
, pp. 548-559
-
-
Park, J.1
Kim, H.2
Jeong, Y.3
Kim, J.4
Pak, J.5
Kam, D.6
Kim, J.7
-
9
-
-
0028754660
-
Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips or striplines
-
Dec.
-
P. A. Kok and D. D. Zutter, "Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips or striplines," IEEE Trans. Microw. Theory Tech., vol.42, no.12, pp. 2270-2276, Dec. 1994.
-
(1994)
IEEE Trans. Microw. Theory Tech.
, vol.42
, Issue.12
, pp. 2270-2276
-
-
Kok, P.A.1
Zutter, D.D.2
-
10
-
-
0035519401
-
Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs
-
Nov.
-
J. Fan, J. L. Drewniak, J. L. Knighten, N. W. Smith, A. Orlandi, T. P. V. Doren, T. H. Hubing, and R. E. Dubroff, "Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs," IEEE Trans. Electromagn. Compat., vol.43, no.4, pp. 588-599, Nov. 2001.
-
(2001)
IEEE Trans. Electromagn. Compat.
, vol.43
, Issue.4
, pp. 588-599
-
-
Fan, J.1
Drewniak, J.L.2
Knighten, J.L.3
Smith, N.W.4
Orlandi, A.5
Doren, T.P.V.6
Hubing, T.H.7
Dubroff, R.E.8
-
11
-
-
77949541689
-
-
High Frequency Structure Simulator (HFSS). Pittsburgh, PA. [Online]. Available
-
High Frequency Structure Simulator (HFSS). Ansoft Softw., Pittsburgh, PA, 2009. [Online]. Available: http://www.ansoft.com
-
(2009)
Ansoft Softw
-
-
|