Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2008, Pages 95-98

  Oo, Zaw Zaw ^a,b   Wei, Xing Chang ^a   Liu, En Xiao ^a   Li, Er Ping ^a,b   Li, Le Wei ^b  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DISTRIBUTED PARAMETER NETWORKS; DISTRIBUTION OF GOODS; ELECTRIC NETWORK ANALYSIS; ELECTRIC POWER DISTRIBUTION; ELECTRONICS PACKAGING; FEATURE EXTRACTION; MULTILAYERS; TRANSIENT ANALYSIS;

ADVANCED ELECTRONIC PACKAGES; EFFICIENT ANALYSES; ELECTRONIC PACKAGES; EQUIVALENT NETWORKS; GROUND PLANES; KEY FEATURES; MODAL DECOUPLING; MODELING METHODS; MULTIPLE VIAS; POWER DISTRIBUTION NETWORKS; SIGNAL TRACES;

PUBLIC KEY CRYPTOGRAPHY;

EID: 58049089249     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2008.4675886     Document Type: Conference Paper

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