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Volumn 50, Issue 3 PART 2, 2008, Pages 740-743

Efficient modeling of rerouted return currents in multilayered power-ground planes by using integral equation

Author keywords

Equivalent circuit; Integral equation; Power integrity and signal integrity; Power ground (PG) planes

Indexed keywords

COMPUTER NETWORKS; ELECTRONIC EQUIPMENT MANUFACTURE; ENERGY ABSORPTION; MATRIX ALGEBRA; NETWORKS (CIRCUITS); POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SIGNAL PROCESSING; TRANSIENT ANALYSIS;

EID: 51049117696     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2008.924392     Document Type: Article
Times cited : (41)

References (8)
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  • 3
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    • Application of the foldy-lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards
    • Jan
    • C. J. Ong, D. Miller, L. Tsang, B. Wu, and C. C. Huang, "Application of the foldy-lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards," Microw. Opt. Technol. Lett., vol. 49, no. 1, pp. 225-231, Jan. 2007.
    • (2007) Microw. Opt. Technol. Lett , vol.49 , Issue.1 , pp. 225-231
    • Ong, C.J.1    Miller, D.2    Tsang, L.3    Wu, B.4    Huang, C.C.5
  • 4
    • 2442447244 scopus 로고    scopus 로고
    • A coupled efficient and systematic full wave time domain macromodeling and circuit simulation for high speed interconnects
    • Feb
    • E. P. Li, E. X. Liu, L. W. Li, and M. S. Leong, "A coupled efficient and systematic full wave time domain macromodeling and circuit simulation for high speed interconnects," IEEE Trans. Adv. Packag. vol. 27, no. 1, pp. 213-223, Feb. 2004.
    • (2004) IEEE Trans. Adv. Packag , vol.27 , Issue.1 , pp. 213-223
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  • 5
    • 35348873663 scopus 로고    scopus 로고
    • A novel approach for system level package modeling to address signal and power integrity issues
    • Reno, NV, May
    • X. C. Wei, E. X. Liu, Z. Z. Oo, E. P. Li, and R. Vahldieck, "A novel approach for system level package modeling to address signal and power integrity issues," in Proc. 57th Electron. Compon. Technol. Conf. Reno, NV, May 2007, pp. 1653-1658.
    • (2007) Proc. 57th Electron. Compon. Technol. Conf , pp. 1653-1658
    • Wei, X.C.1    Liu, E.X.2    Oo, Z.Z.3    Li, E.P.4    Vahldieck, R.5
  • 6
    • 0036602446 scopus 로고    scopus 로고
    • Simple and efficient full-wave modeling of electromagnetic coupling in realistic RF multiplayer PCB layouts
    • Jun
    • M. R. Abdul-Gaffoor, H. K. Smith, A. A. Kishk, and A. W. Glisson, "Simple and efficient full-wave modeling of electromagnetic coupling in realistic RF multiplayer PCB layouts," IEEE Trans. Microw. Theory Tech., vol. 50, no. 6, pp. 1445-1457, Jun. 2002.
    • (2002) IEEE Trans. Microw. Theory Tech , vol.50 , Issue.6 , pp. 1445-1457
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  • 7
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    • Online, Available
    • Ansoft Software [Online]. Available: http://www.ansoft.com.
    • Ansoft Software


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.