Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 3, 2008, Pages 536-543

  Wei, Xing Chang ^a   Li, Er Ping ^a   Liu, En Xiao ^a   Chua, Eng Kee ^a   Oo, Zaw Za ^a   Vahldieck, R ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b ETH ZURICH   (Switzerland)

Author keywords

Dyadic Green's function; Electromagnetic compatibility; High speed electronic package; Integral equation; Powerground planes; Simultaneous switching noise

Indexed keywords

COMPLETE SOLUTIONS; COMPUTATIONAL DOMAINS; DYADIC GREEN'S FUNCTION; ELECTROMAGNETIC EMISSIONS; EXTERNAL INTERFERENCES; FINITE SIZES; FREE SPACES; GROUND PLANES; HIGH-SPEED ELECTRONIC PACKAGE; INTEGRAL EQUATION METHODS; MAGNETIC CURRENTS; NOVEL METHODS; POWERGROUND PLANES; RADIATED FIELDS; RECTANGULAR CAVITIES; SIMULTANEOUS SWITCHING NOISE; SUB DOMAINS; SYSTEM LEVELS;

ANTENNAS; ELECTRIC INVERTERS; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETISM; INTEGRAL EQUATIONS; JITTER; SWITCHING;

GREEN'S FUNCTION;

EID: 54049085454     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.927841     Document Type: Article

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