Design and fabrication of 0/1-level RF-via interconnect for RF-MEMS packaging applications

IEEE Transactions on Advanced Packaging

Volumn 33, Issue 1, 2010, Pages 30-36

  Hsu, Li Han ^a,b   Wu, Wei Cheng ^a,b   Chang, Edward Yi ^a   Zirath, Herbert ^b   Wu, Yun Chi ^a   Wang, Chin Te ^a   Lee, Ching Ting ^c  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Fabrication; Interconnections; Microelectromechanical devices; Microwave technology; Packaging

Indexed keywords

DESIGN RULES; FLIP CHIP BUMPS; INTERCONNECT PERFORMANCE; INTERCONNECT STRUCTURES; KEY PARAMETERS; METAL PAD; MICROWAVE TECHNOLOGY; PARAMETRIC STUDY; RETURN LOSS; RF-MEMS; TRANSMISSION LINE; VIA INTERCONNECT;

BANDPASS FILTERS; CHIP SCALE PACKAGES; FABRICATION; FLIP CHIP DEVICES; MEMS; MICROWAVE DEVICES; MICROWAVES; PACKAGING; PARAMETRIC DEVICES;

MICROELECTROMECHANICAL DEVICES;

EID: 77949271484     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2034137     Document Type: Article

References (14)

1. G. M. Rebeiz and J. B. Muldavin, "RF MEMS switches and switch circuits," IEEE Microwave Mag., vol. 2, no. 4, pp. 59-71, Dec. 2001.
2. H. J. De Los Santos, G. Fischer, H. A. C. Tilmans, and J. T. M. van Beek, "RF MEMS for ubiquitous wireless connectivity. Part II. Application," IEEE Microwave Mag., vol. 5, no. 4, pp. 50-65, Dec. 2004.
3. A. Jourdain, X. Rottenberg, G. Carchon, and H. A. C. Tilmans, "Optimization of 0-level packaging for RF-MEMS devices," in Proc. Trans-ducer'03, Boston, MA, Jun. 2003, vol. 2, pp. 1915-1918.
4. G. Carchon, A. Jourdain, O. Vendier, J. Schoebel, and H. A. C. Tilmans, "Integration of 0/1-level packaged RF-MEMS devices on MCM-D at millimeter-wave frequencies," in Proc. Electron. Compon. Technol. Conf., Jun. 2005, vol. 2, pp. 1664-1669.
5. A. Margomenos, D. Peroulis, J. P. Becker, and L. P. B. Katehi, "Silicon micromachined interconnects for on-wafer packaging of MEMS devices," in Silicon Monolithic Integrated Circuits RF Syst., Sep. 2001, pp. 33-36.
6. A. Margomenos, D. Peroulis, K. J. Herrick, and L. P. B. Katehi, "Silicon micromachined packages for RF MEMS switches," in Eur. Mi-crow. Conf., Oct. 2001, pp. 1-4.
7. D. Staiculescu, J. Laskar, and E. M. Tentzeris, "Design rule development for microwave flip-chip applications," IEEE Trans. Microw. Theory Tech., vol. 48, no. 9, pp. 1476-1481, Sep. 2000.
8. F. J. Schmuckle, A. Jentzsch, C. Gassler, P. Marschall, D. Geiger, and E. Heinrich, "40 GHz hot-via flip-chip interconnects," in IEEE MTT-S Int. Microwave Symp. Dig., Jun. 2003, vol. 2, pp. 1167-1170.
9. A. Bessemoulin, C. Gaessler, P. Marschall, and P. Quentin, "A chip-scale packaged amplifier MMIC using broadband hot-via transitions," in Eur. Microw. Conf., Oct. 2003, pp. 289-292.
10. W.-C. Wu, L.-H. Hsu, E. Y. Chang, C. Karnfelt, H. Zirath, J. P. Starski, and Y.-C. Wu, "60 GHz broadband MS-to-CPW hot-via flip chip interconnects," IEEE Microwave Wireless Compon. Lett., vol. 17, no. 11, pp. 784-786, Nov. 2007.
11. W.-C. Wu, L.-H. Hsu, E. Y. Chang, J. P. Starski, and H. Zirath, "60 GHz broadband 0/1-level RF-via interconnect for RF-MEMS packaging," Electron. Lett., vol. 43, no. 22, Oct. 2007.
12. G. E. Ponchak, J. Papapolymerous, and M. M. Tentzeris, "Excitation of coupled slotline mode in finite-ground CPW with unequal ground-plane widths," IEEE Trans. Microw. Theory Tech., vol. 53, no. 2, pp. 713-717, Feb. 2005.
13. A. Jentzsch and W. Heinrich, "Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz," IEEE Trans. Microw. Theory Tech., vol. 49, no. 5, pp. 871-878, May 2001.
14. W. C. Wu, H. T. Hsu, E. Y. Chang, C. S. Lee, C. H. Huang, Y. C. Hu, L. H. Hsu, and Y. C. Lien, "Flip-chip packaged In0.52Al0.48As/InGaAs metamorphic HEMT device for millimeter wave application," in Proc. CS-MAX, Compound Semicond. Manufact. Expo, Nov. 2005, pp. 94-97.