A chip-scale packaged amplifier MMIC using broadband hot-via transitions

Conference Proceedings - 33rd European Microwave Conference, EuMC 2003

Volumn 1, Issue , 2003, Pages 289-292

  Bessemoulin, A ^a   Gaessler, C ^a   Marschall, P ^b   Quentin, P ^a  

^a United Monolithic Semiconductors GmbH   (Germany)

^b DAIMLER AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

LOW NOISE AMPLIFIERS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

BACKSIDE METALLIZATION; BCB COATINGS; CARRIER SUBSTRATE; CHIP-SCALE; GHZ FREQUENCIES; HOT-VIA TRANSITION; LINEAR GAIN; MICROSTRIP AMPLIFIERS;

BROADBAND AMPLIFIERS;

EID: 84897491763     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2003.1262276     Document Type: Conference Paper

References (7)

1. K. Beilenhoff, A. Bessemoulin, P. Quentin, S. Trancuant, O. Vaudescal, M. Parisot, H. Daembkes, "Full 26-GHz MMIC Chipset for Telecom Applications in SMD-Type Packages", in Proc. of the Gallium Arsenide & Other Semiconductors Application Symposium (GAAS 2002), pp. 331-334, Milan, Italy. September 2002.
2. M. Schlechtweg, A. Bessemoulin, A. Tessmann, S, Kudszus, W. Marsetz, A. Hülsmann, W. H. Haydl, "Trends and Challenges in Coplanar Millimeter-wave Integrated Circuit Design," in Proceedings of the 30 European Microwave Conference 2000, Vol.2, pp. 399-402.
3. Kyocera America Inc., "A DC to Ka-band low cost Surface Mountable RF-V1A Package," Microwave Journal, pp. 216-222, January 2001.
4. P. Quentin, "Procédé d'interoonnexion entre un circuit intégré et un support, et circuit intégré adapté à ce procédé," Thomson-CSF, French Patent no 2 665 574, U.S. Patentno 5 158 911, July 1990.
5. P. Monfraix, T. Adam, J.L. Lacoste, C. Drevon, G. Naudy, B. Cogo, J.L. Cazaux, J.J. Roux, "Design to reliability shielded vertical interconnection applied to microwave chip scale packaging", 30th European Microwave Conference., vol. 1, pp.409-412, 2000.
6. F.J. Schmückle, A. Jentzsch, C. Gassier, P. Marschall, D. Geiger, and W. Heinrich, "40 GHz Hot-Via Flip-Chip Interconnects," IEEE MTT-S Int. Microwave Symp. Dig, pp. 1167-1170, 2003.
7. CHA2190 product datasheet, United Monolithic Seminconductors, Feb. 2002.