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Volumn , Issue , 2001, Pages 33-36

Silicon micromachined interconnects for on-wafer packaging of MEMS devices

Author keywords

micromachining; packaging; RF MEMS switch

Indexed keywords

ELECTRIC SWITCHES; ELECTRONICS PACKAGING; FABRICATION; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUITS; MICROMACHINING; PACKAGING; SILICON; SILICON WAFERS;

EID: 2942511301     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SMIC.2001.942336     Document Type: Conference Paper
Times cited : (13)

References (9)
  • 8
    • 0006468369 scopus 로고    scopus 로고
    • Zeland Software Inc. Fremont CA
    • Zeland Software, Inc., Fremont, CA, IE3D Users Manual, Release 8, 2001
    • (2001) IE3D Users Manual, Release , vol.8
  • 9
    • 0033694042 scopus 로고    scopus 로고
    • Multilevel finite ground coplanar line transitions for high-Density Packaging Using Silicon Micromachining
    • Boston, MA, June
    • J.P. Becker and L.P.B. Katehi, Multilevel Finite Ground Coplanar Line Transitions for High-Density Packaging Using Silicon Micromachining, in 2000 IEEE MTT-S International Microwave Symposium Digest, Boston, MA, June 2000, pp. 303-306
    • (2000) 2000 IEEE MTT-S International Microwave Symposium Digest , pp. 303-306
    • Becker, J.P.1    Katehi, L.P.B.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.