40 GHz hot-via flip-chip interconnects

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2003, Pages 1167-1170

  Schmuckle F J ^a   Jentzsch, A ^a   Gassier C ^b   Marschall, P ^b   Geiger, D ^b   Heinrich, W ^a  

^a LEIBNIZ INSTITUT FÜR HÖCHSTFREQUENZTECHNIK   (Germany)

^b U Monolithic Semiconductors GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; CHIP SCALE PACKAGES; COMPUTER SIMULATION; SEMICONDUCTING GALLIUM ARSENIDE; WAVEGUIDE COMPONENTS;

FLIP-CHIP INTERCONNECTS;

INTERCONNECTION NETWORKS;

EID: 17544403489     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. R.Sturdivant, C. Quan and J. Wooldridge, "Investigation of MMIC flip-chips with sealants for improved reliability without hermiticity", in 1996 IEEE MTT-S Int. Microwave Symp. Dig., vol. 1, pp.239-242,1996.
2. Patent "Procede d'interconnexion entre un circuit integre et un support, et circuit integre adapte a ce procede", July 1990, French patent number: 2 665 574, U.S. patent number: 5 158 911, Pierre Quentin, Thomson-CSF
3. T.E.Kazior, H.N. Atkins, A. Fatemi, Y. Chen, F.Y. Colomb and J.P. Wendler, "DBIT-direct backside interconnect technology: a manufacturable, bond wire free interconnect technology for microwave and millimeter wave MMIC's",1997 IEEE MTT-S Int. Microwave Symp. Dig., vol. 2, pp.724-727.
4. th European Microwave Conference., 1, pp.409-412, 2000.
5. F. J. Schmückle, A. Jentzsch, W. Heinrich, J. Butz, M. Spinnler, "LTCC as MCM Substrate: Design of Strip-Line Structures and Flip-Chip Interconnects," 2007 IEEE MTT-S Int. Microwave Symp. Dig., vol. 3, pp. 1903-1906.