Integration of 0/1-level packaged RF-MEMS devices on MCM-D at millimeter-wave frequencies

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1664-1669

  Carchon, Geert ^a   Jourdain, Anne ^a   Vendier, Olivier ^b   Schoebel, Joerg ^c   Tilmans, Harrie A C ^a  

^a IMEC   (Belgium)

^b THALES ALENIA SPACE   (France)

^c ROBERT BOSCH GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; FLIP CHIP DEVICES; FREQUENCIES; MICROELECTRODES; MILLIMETER WAVES; OPTICAL SWITCHES;

EMBEDDED PASSIVES; MILLIMETER WAVE FREQUENCIES; ON-CHIP CAVITY; STUD-BUMPS;

ELECTRONICS PACKAGING;

EID: 24644489304     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

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