Diffusion bonding of Al 6061 alloys using an eutectic reaction of Al-Ag-Cu

Key Engineering Materials

Volumn 297-300 IV, Issue , 2005, Pages 2772-2777

  Lee, Y S ^a   Lim, C H ^a   Lee, C H ^a,a   Seo, K W ^a   Shin, S Y ^b  

^a Inha University   (South Korea)

^b Korea Institute of Industrial Technology   (South Korea)

Author keywords

AA6061; Ag 28Cu; Bonding; Diffusion; Filler metal; T6 treatment

Indexed keywords

DIFFUSION BONDING; FILLER METALS; INTERFACES (MATERIALS); TENSILE STRENGTH;

EUTECTIC MELTS; EUTECTIC REACTION;

ALUMINUM ALLOYS;

EID: 34249703907     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-978-4.2772     Document Type: Conference Paper

References (12)

1. Y. Sugiyama: Welding International (8) (1989), p. 700
2. J.C. Warner and W.C. Weltman: Welding Journal March (1979), p. 25
3. W.J. Werner, G.M. Slaughter and F.B. Gurtner: Welding Research Supplement February (1972), p. 64
4. G. Humpston, S.P.S. Sangha and D.M. Jacobson: Mater. Sci. Technol. Vol. 11 (1995), p. 1161
5. T. Kayamoto and T. Onzawa: Welding International 10 (1996), p. 363
6. T.H. Chuang, M.S. Yeh, L.C. Tsao and C.S. Wu: Metall. Mater. Trans. Vol. 31A (2000), p. 2239
7. J.T. Nieman and R.A. Garnrett: Welding Research Supplement April (1974), p. 175
8. A. Urena, J.M. Gomez De Salazar, J. Quinones, S. Merino and J.J. Martin: J. Mater. Sci. Vol. 31 (1996), p. 807
9. D.V. Dunford and P.G. Partridge: Mater. Sci. Tech. Vol. 8 (1992), p. 385
10. S.Y. Shin, D.C. Cho, C.H. Lee, K.S. Shin and K. Park: J. Mater. Sci. Letters Vol. 21 (2002), p. 903
11. L. Shugi and Z. Shimin: Acta Metallurgica Sinica Vol. 19 No. 2 (April 1983), p. 70
12. J.T. Nieman and G.W. Wille: Welding Research Supplement October (1978), p. 285