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Materials Science and Technology

Volumn 18, Issue 1, 2002, Pages 68-72

Diffusion bonding between Ti-6Al-4V alloy and microduplex stainless steel with copper interlayer

(3) Eroglu M a Khan, T I a Orhan, N a

a FIRAT UNIVERSITY (Turkey)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY; ALUMINUM; COPPER; IRON; STAINLESS STEEL; TITANIUM; VANADIUM;

ARTICLE; CHEMICAL BOND; CHEMICAL STRUCTURE; DIFFUSION; ENERGY; HARDNESS; HEATING; MICROSCOPY; SPECTROSCOPY; STRENGTH;

EID: 0036174250 PISSN: 02670836 EISSN: None Source Type: Journal
DOI: 10.1179/026708301125000230 Document Type: Article

Times cited : (93)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.