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Volumn 18, Issue 1, 2002, Pages 68-72
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Diffusion bonding between Ti-6Al-4V alloy and microduplex stainless steel with copper interlayer
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Author keywords
[No Author keywords available]
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Indexed keywords
ALLOY;
ALUMINUM;
COPPER;
IRON;
STAINLESS STEEL;
TITANIUM;
VANADIUM;
ARTICLE;
CHEMICAL BOND;
CHEMICAL STRUCTURE;
DIFFUSION;
ENERGY;
HARDNESS;
HEATING;
MICROSCOPY;
SPECTROSCOPY;
STRENGTH;
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EID: 0036174250
PISSN: 02670836
EISSN: None
Source Type: Journal
DOI: 10.1179/026708301125000230 Document Type: Article |
Times cited : (94)
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References (17)
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