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Volumn 18, Issue 1, 2002, Pages 68-72

Diffusion bonding between Ti-6Al-4V alloy and microduplex stainless steel with copper interlayer

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY; ALUMINUM; COPPER; IRON; STAINLESS STEEL; TITANIUM; VANADIUM;

EID: 0036174250     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708301125000230     Document Type: Article
Times cited : (94)

References (17)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.