Microstructure and mechanical properties of Al 6061 joints diffusion brazed using Cu interlayer

Journal of Materials Science Letters

Volumn 21, Issue 12, 2002, Pages 903-906

  Shin, S Y ^a   Ko, M W ^a   Cho, D C ^b   Lee, C H ^b   Shin, K S ^c   Park, K ^d  

^a Korea Institute of Industrial Technology   (South Korea)

^b Inha University   (South Korea)

^c Changwon National University   (South Korea)

^d Sejong University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGE HARDENING; BOND STRENGTH (MATERIALS); BRAZING; COMPOSITION; COPPER; HARDNESS; JOINTS (STRUCTURAL COMPONENTS); METALLOGRAPHIC MICROSTRUCTURE; OPTICAL MICROSCOPY; TENSILE STRENGTH; TENSILE TESTING; VICKERS HARDNESS TESTING;

BUTT JOINTS; COPPER INTERLAYERS; DIFFUSION BRAZING; ELECTRON PROBE MICROANALYSIS; KELLER ETCHANT;

ALUMINUM ALLOYS;

EID: 0037098298     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1016092818067     Document Type: Article

References (12)