Novel SU-8 based vacuum wafer-level packaging for MEMS devices

Microelectronic Engineering

Volumn 87, Issue 5-8, 2010, Pages 1173-1176

  Murillo, Gonzalo ^a   Davis, Zachary J ^b   Keller, Stephan ^b   Abadal, Gabriel ^a   Agusti, Jordi ^a   Cagliani, Alberto ^b   Noeth, Nadine ^b   Boisen, Anja ^b   Barniol, Nuria ^a  

^a UNIVERSITAT AUTÒNOMA DE BARCELONA   (Spain)

^b TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

MEMS; SU 8; Vacuum packaging; Wafer level packaging

Indexed keywords

ADHESIVE BONDING; ADHESIVE MATERIALS; CANTILEVER RESONATORS; MECHANICAL RELIABILITY; MEMSDEVICES; NOVEL TECHNIQUES; OPTICAL INSPECTION; QUALITY FACTORS; SEM IMAGE; VACUUM LEVEL; VACUUM PACKAGING; WAFER LEVEL; WAFER LEVEL PACKAGING; WAFER LEVEL VACUUM PACKAGING;

CHEMICAL REACTIONS; CHEMICAL RESISTANCE; MECHANICAL PROPERTIES; MEMS; MICROELECTROMECHANICAL DEVICES; OPTICAL PROPERTIES; OPTICAL TESTING; PACKAGING; PHOTORESISTS; VACUUM; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 76949094192     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.12.048     Document Type: Article

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