Gas permeability of adhesives and their application for hermetic packaging of microcomponents

Microsystem Technologies

Volumn 7, Issue 1, 2001, Pages 17-22

  Gerlach, A ^a,b   Keller, W ^a   Schulz, J ^a   Schumacher, K ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^b Greiner Bio One GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042406464     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420000056     Document Type: Article

References (14)

1. Byrnes M; Carter JL; Sergent JE; King D (1984) Considerations in the hermetic packaging of hybrid microcircuits. Solid State Technol 27: 183-186
2. Puers B; Lapadatu D (1994) Extremely miniaturized capacitive movement sensors using new suspension systems. Sensors Actuators A41-42: 129-135
3. Tummala RR; Rymanzewski EJ (eds) (1989) Microelectronics Packaging Handbook, New York, pp. 736-755
4. Mc Neil VM; et al (1993) Design and fabrication of thin-film microaccelerometers using wafer bonding. Technical Digest 7th Int Conf on Solid State Sensors and Actuators, p. 822 ff
5. Gerlach A; Maas D; Seidel D (1998) Influence of gold thin-film interlayers on anodic bonding of copper microstructures produced by LIGA. Microsystem Technol 5: 100-104
6. Gerlach A; Lambach H; Seidel D (1999) Propagation of adhesives in joints during capillary adhesive bonding of microcomponents. Microsystem Technol 6: 19-22
7. Maas D; Büstgens B; Fahrenberg J; Keller W; Ruther P; Schomburg WK; Seidel D (1996) Fabrication of microcomponents using adhesive bonding techniques. Proc MEMS '96, San Diego, pp. 331-336
8. Traeger RK (1976) Hermeticity of polymeric lid sealants. Proc Electr Comp Conf 26: 361-367
9. Schumacher K; Krömer O; Wallrabe U; Mohr J; Saile V (1999) Micromechanical LIGA-Gyroscope. Proc Transducer '99, Sendai, Japan, pp. 1574-1577
10. Ma C; Shero E; Verma N; Gilbert SL; Shadman F (1995) Permeation of moisture and oxygen through polymeric o-rings. J IES 38: 43-46
11. Peacock RN (1980) Practical selection of elastomer materials for vacuum seals. J Vac Sci Technol 17: 330-336
12. Brinson HF (ed) (1989) Engineered materials handbook Vol. 3. Adhesives and sealants, ASM International, p. 622
13. Brandrup J; Immergut EH (eds) (1989) Polymer handbook. Wiley, New York, p. VI 435
14. Harder T; Ehlers T; Kolbe W; Hieber H (1994) Hermetic polymer packages. Proc EuPac 94, Essen, Germany, pp. 1-5