Spatially extended atmospheric plasma arrays

Plasma Sources Science and Technology

Volumn 19, Issue 2, 2010, Pages

  Cao, Z ^a   Nie, Q ^a,b   Bayliss, D L ^a   Walsh, J L ^a   Ren, C S ^b   Wang, D Z ^b   Kong, M G ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

2D ARRAYS; ARRAY STRUCTURES; ATMOSPHERIC PLASMAS; CONTINUOUS MODE; ELECTRON DENSITIES; EXCITATION FREQUENCY; HIGH-CURRENT; JET ARRAYS; JET INTERACTIONS; LARGE-SCALE PROCESSING; LOW TEMPERATURES; PARALLELIZATIONS; PLASMA DYNAMICS; PLUME LENGTH; REACTION CHEMISTRY; REACTIVE SPECIES; RING ELECTRODES; SAMPLE SURFACE; SINGLE JET; STEP CHANGES; STRONG INTERACTION; SYSTEMATIC STUDY;

ATMOSPHERIC CHEMISTRY; DYNAMICS; MAGNETOHYDRODYNAMICS; PLASMA ACCELERATORS; PLASMA JETS; PLASMAS; TWO DIMENSIONAL;

PLASMA DIAGNOSTICS;

EID: 76849113603     PISSN: 09630252     EISSN: 13616595     Source Type: Journal    
DOI: 10.1088/0963-0252/19/2/025003     Document Type: Article

References (72)

1. Iza F, Kim G J, Lee S M, Lee J K, Walsh J W, Zhang Y T and Kong M G 2008 Plasma Process. Polym. 5 322
2. Kogelschatz U 2003 Plasma Chem. Plasma Process. 23 1
3. Kunhardt E E 2000 IEEE Trans. Plasma. Sci. 28 189
4. Becker K H, Schoenbach K H and Eden J G 2006 J. Phys. D: Appl. Phys. 39 R55
5. Shi W, Stark R H and Schoenbach K H 1999 IEEE Trans. Plasma. Sci. 27 16
6. Eden J G et al 2003 J. Phys. D: Appl. Phys. 36 2869
7. Shi J J and Kong M G 2006 Phys. Rev. Lett. 96 105009
8. Eden J G and Park S J 2006 Phys. Plasmas 13 057101
9. Stoffels E, Flikweert A J, Stoffels W W and Kroesen G M W 2002 Plasma Sources Sci. Technol. 11 383
10. Girard-Lauriault P L, Mwale F, Iordanova M, Demers C, Desjardins P and Wertheimer M R 2005 Plasma Process. Polym. 2 263
11. Chen C K, Perry W L, Xu H, Jiang Y and Phillips J 2003 Carbon 41 2555
12. Park S J, Chen J, Liu C and Eden J G 2001 Appl. Phys. Lett. 78 419
13. Sakai O, Sakaguchi T and Tachibana K 2007 J. Appl. Phys. 101 073304
14. Fridman G, Friedman G, Gutsol A, Shekhter A B, Vasilets V N and Fridman A 2008 Plasma Process. Polym. 5 503
15. Kong M G, Kroesen G M W, Morfill G E, Nosenko T, Shimizu T, van Dijk J and Zimmermann J L 2009 New J. Phys. 11 115012
16. Cao Z, Walsh J L and Kong M G 2009 Appl. Phys. Lett. 94 021501
17. Walsh J L, Shi J J and Kong M G 2006 Appl. Phys. Lett. 88 171501
18. Koretzky E and Kuo S P 1998 Phys. Plasmas 5 3774
19. Kuo S P, Koretzky E and Orlick L 1999 IEEE Trans. Plasma Sci. 27 752
20. Hubicka Z, Cada M, Si cha M, Churpita A, Pokorny P, Soukup L and Jastrabi k L 2002 Plasma Sources Sci. Technol. 11 195
21. Foest R, Kindel E, Ohl A, Stieber M and Weltmann K D 2005 Plasma Phys. Control. Fusion 47 B525
22. Shimizu T et al 2008 Plasma Process. Polym. 5 577
23. Walsh J W and Kong M G 2008 Appl. Phys. Lett. 93 111501
24. Sankaran R M, Giapis K P, Moselhy M and Schoenbach K H 2003 Appl. Phys. Lett. 83 4728
25. Deng X T, Shi J, Shama G and Kong M G 2005 Appl. Phys. Lett. 87 153901
26. Forster S, Mohr C and Viol W 2005 Surf. Coat. Technol. 200 827
27. Niemi K, Schulz-von der Gathen V and Dobele H F 2005 Plasma Sources Sci. Technol. 14 375
28. Zhu W C, Wang B R, Yao Z X and Pu Y K 2005 J. Phys. D: Appl. Phys. 38 1396
29. Deng X T, Shi J and Kong M G 2006 IEEE Trans. Plasma Sci. 34 1310
30. Yu H, Perni S, Shi J J, Wang D Z, Kong M G and Shama G 2006 J. Appl. Microbiol. 101 1323
31. Shakir S, Mynampati S, Pashaie B and Dhali S K 2006 J. Appl. Phys. 99 073303
32. Perni S et al 2007 Appl. Phys. Lett. 90 073902
33. Deng X T, Shi J J and Kong M G 2007 J. Appl. Phys. 101 074701
34. Deng X T, Shi J, Chen H L and Kong M G 2007 Appl. Phys. Lett. 90 013903
35. Kim D B, Rhee J K, Gweon B, Moon S Y and Choe W 2007 Appl. Phys. Lett. 91 151502
36. Leveille V and Coulombe S 2005 Plasma Sources Sci. Technol. 14 467
37. Raballand V, Benedikt J and von Keudell A 2008 Appl. Phys. Lett. 92 091502
38. Walsh J L and Kong M G 2007 Appl. Phys. Lett. 91 221502
39. Laroussi M and Akan T 2007 Plasma Process. Polym. 4 777
40. Perni S, Shama G and Kong M G 2008 J. Food Protect. 71 1619
41. Sands B L, Ganguly B N and Tachibana K 2008 Appl. Phys. Lett. 92 151503
42. Ye R and Zheng W 2008 Appl. Phys. Lett. 93 071502
43. Shi J, Zhong F, Zhang J, Liu D W and Kong M G 2008 Phys. Plasmas 15 013504
44. Walsh J W and Kong M G 2008 IEEE Trans. Plasma Sci. 36 954-5
45. Sousa J S, Bauville G, Lacour B, Puech V, Touzeau M and Pitchford L C 2008 Appl. Phys. Lett. 93 011502
46. Noma Y, Choi J H, Tomai T and Terashima K 2008 Appl. Phys. Lett. 93 101503
47. Lu X P, Jiang Z H, Xiong Q, Tang Z Y and Pan Y 2008 Appl. Phys. Lett. 92 151504
48. Walsh J W, Iza F, Janson N B, Law V and Kong M G 2010 J. Phys. D: Appl. Phys. 43 075201
49. Shi J J and Kong M G 2005 J. Appl. Phys. 97 023306
50. Shi J J and Kong M G 2005 IEEE Trans. Plasma Sci. 33 624
51. Mildren R P and Carman R J 2001 J. Phys. D: Appl. Phys. 34 L1
52. Kong M G and Deng X T 2003 IEEE Trans. Plasma Sci. 31 7
53. Pancheshnyi S V, Lacoste D A, Bourdon A and Laux C O 2006 IEEE Trans. Plasma Sci. 34 2478
54. Walsh J L and Kong M G 2006 Appl. Phys. Lett. 89 231503
55. Walsh J W, Shi J J and Kong M G 2006 Appl. Phys. Lett. 89 161505
56. Ayan H, Staack D, Fridman G, Gutsol A, Mukhin Y, Starikovskii A, Fridman A and Friedman G 2007 J. Phys. D: Appl. Phys. 42 125202
57. Deng X T and Kong M G 2004 IEEE Trans. Plasma Sci. 32 1709
58. Nie Q Y, Cao Z, Ren C S, Wang D Z and Kong M G 2009 New J. Phys. 11 115015
59. Walsh J W, Liu D X, Iza F, Rong M Z and Kong M G 2010 J. Phys. D: Appl. Phys. 43 032001
60. Muller I, Punset C, Ammelt E, Purwins H G and Boeuf J P 1999 IEEE Trans. Plasma Sci. 27 20
61. Schoenbach K H and Shi W 2004 Plasma Sources Sci. Technol. 13 177
62. Wang Y H, Zhang Y T, Wang D Z and Kong M G 2007 Appl. Phys. Lett. 90 071501
63. Sakiyama Y and Graves D B 2006 J. Phys. D: Appl. Phys. 39 3644
64. Ichiki T, Koidesawa T and Horiike Y 2003 Plasma Sources Sci. Technol. 12 S16
65. Shimizu Y, Sasaki T, Ito T, Terashima K and Koshizaki N 2003 J. Phys. D: Appl. Phys. 36 2940
66. Iza F and Hopwood J A 2003 IEEE Trans. Plasma Sci. 31 782
67. Kim J and Terashima K 2005 Appl. Phys. Lett. 86 191504
68. Fridman G, Peddinghaus M, Balasubramanian M, Ayan H, Fridman A, Gutsol A and Brooks A 2006 Plasma Chem. Plasma Process. 26 425
69. Shimizu K, Sugiyama T and Samaratunge M N L 2008 IEEE Trans. Ind. Appl 44 506
70. Baars-Hibbe, Sichler P, Schrader C, Lucas N and Gericke K H 2005 J. Phys. D: Appl. Phys. 38 510
71. Lucas N, Ermel V, Kurrat M and Buttgenbach S 2008 J. Phys. D: Appl. Phys. 41 215202
72. Thomas M, von Hausen M, Klages C P and Baumhof P 2007 Plasma Process. Polym. 4 S475