Adhesion enhancement between electroless copper and epoxy-based dielectrics

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 4, 2009, Pages 758-767

  Hayden, Harley ^a   Elce, Ed ^a   Allen, Sue Ann Bidstrup ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Adhesion; Dielectric materials; Electroless copper; Plasma processing

Indexed keywords

ADHESION ENHANCEMENT; BACKBONE POLYMER; CHEMICAL BONDINGS; ELECTROLESS COPPER; MECHANICAL ANCHORING; NORBORNENES; NOVEL TECHNIQUES; NOVOLAC EPOXY; PEEL STRENGTH; PLASMA PROCESSING; PLASMA TREATMENT; POLYMER SURFACES; ROUGHNESS DEVELOPMENT;

ADHESION; BONDING; CHEMICAL BONDS; COPPER; ELECTROLESS PLATING; MECHANISMS; PHENOLS; PLASMA APPLICATIONS; PLASMA DEVICES; PLASMAS; SURFACE TREATMENT;

DIELECTRIC MATERIALS;

EID: 74649085680     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2017274     Document Type: Article

References (26)

1. A. Ahagon and A. N. Gent, J. Polymer Sci. Part B-Polymer Phys., vol. 13, pp. 1285-1300, 1975.
2. M. B. Chan-Park and S. S. Tan, Int. J. Adhesion Adhesives, vol. 22, pp. 471-475, 2002.
3. J. Ge, R. Tuominen, and J. K. Kivilahti, J. Adhesion Sci. Technol., vol. 15, pp. 1133-1143, 2001.
4. J. Ge, M. Turunen, and J. Kivilahti, Thin Solid Films, vol. 440, pp. 198-207, 2003.
5. D. Schroer, R. J. Nichols, and H. Meyer, Electrochimica Acta, vol. 40, pp. 1487-1494, 1995.
6. S. Siau, A. Vervaet, L. Van Vaeck, E. Schacht, U. Demeter, and A. Van Calster, J. Electrochem. Soc., vol. 152, pp. C442-C455, 2005.
7. S. Siau, A. Vervaet, S. Nalines, E. Schacht, and A. Van Calster, J. Electrochem. Soc., vol. 151, pp. C816-C830, 2004.
8. S. Siau, A. Vervaet, S. Nalines, E. Schacht, and A. Van Calster, J. Electrochem. Soc., vol. 151, pp. C831-C849, 2004.
9. International Technology Roadmap for Semiconductors 2006 [Online].Available: http://public.itrs.net/
10. W. Dressick, C. Dulcey, J. Georger, G. Calabrese, and J. Calvert,J. Electrochem. Soc., vol. 141, pp. 210-220, 1994.
11. F. M. Fowkes, Indust. Eng. Chem., vol. 56, p. 40, 1964.
12. A. N. Gent and S. M. Lai, J. Polymer Sci. Part B-Polymer Phys., vol. 32, pp. 1543-1555, 1994.
13. M. Charbonnier, Y. Goepfert, M. Romand, and D. Leonard, J. Adhesion, vol. 80, pp. 1103-1130, 2004.
14. M. S. Chen, S. L. Brandow, C. S. Dulcey, W. J. Dressick, G. N. Taylor, J. F. Bohland, J. H. G. Georger, E. K. Pavelchek, and J. M. Calvert,J. Electrochem. Soc., vol. 146, pp. 1421-1430, 1999.
15. Y. J. Chen, E. T. Kang, K. G. Neoh, and W. Hang, Langmuir, vol. 17, pp. 7425-7432, 2001.
16. Z. Yu, E. Kang, and K. Neoh, Polymer, vol. 43, pp. 4137-4146, 2002.
17. D. Bhusari, H. Hayden, R. Tanikella, S. A. B. Allen, and P. A. Kohl,J. Electrochem. Soc., vol. 152, pp. F162-F170, 2005.
18. J. F. Friedrich, R. Mix, and G. Kuhn, Surface Coatings Technol., vol. 174, pp. 811-815, 2003.
19. J. F. Friedrich, R. Mix, and G. Kuhn, Surface Coatings Technol., vol. 200, pp. 565-568, 2005.
20. S. K. Koh, S. C. Park, S. R. Kim, W. K. Choi, H. J. Jung, and K. D. Pae, J. Appl. Polymer Sci., vol. 64, pp. 1913-1921, 1997.
21. C. Y. Yang, J. S. Chen, and S. L. C. Hsu, J. Electrochem. Soc., vol. 153, pp. F120-F125, 2006.
22. S. Siau, A. Vervaet, E. Schacht, U. Demeter, and A. Van Calster, Thin Solid Films, vol. 495, pp. 348-356, 2006.
23. W. H. Yu, E. T. Kang, and K. G. Neoh, J. Electrochem. Soc., vol. 149, pp. C592-C599, 2002.
24. , ASTM B Standard 533-85, 2002.
25. P. Chiniwalla, Y. Q. Bai, E. Elce, R. Shick, W. C. McDougall, S. A.B. Allen, and P. A. Kohl, J. Appl. Polymer Sci., vol. 89, pp. 568-577, 2003.
26. J. G. Ryu, H. Kim, and J. W. Lee, Polymer Eng. Sci., vol. 44, pp.1198-1204, 2004.