Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers II. Oxidative treatment of the surface

Journal of the Electrochemical Society

Volumn 151, Issue 12, 2004, Pages

  Siau, Sam ^a   Vervaet, Alfons ^a   Nalines, Sylvie ^a   Schacht, Etienne ^a   Van Calster, Andre ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; POLYMERS; SOLVENTS; SURFACE ROUGHNESS; SWELLING; WETTING;

EPOXY POLYMER LAYERS; LIQUID TREATMENT; POLYMER SURFACE; WET CHEMICAL TREATMENT;

EPOXY RESINS;

EID: 10944242683     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1814011     Document Type: Article

References (27)

1. Z. J. Yu, E. T. Kang, and K. G. Neoh, Langmuir, 18, 10221 (2002).
2. W. H. Yu, Y. Zhang, E. T. Kang, K. G. Neoh, S. Y. Wu, and Y. F. Chow, J. Electrochem. Soc., 149, c521 (2002).
3. M. B. Chan-Park and S. S. Tan, Int. J. Adhes. Adhes., 22, 471 (2002).
4. W. Li and R. Tummala, in Proceedings of the 32nd International Symposium on Microelectronics, Chicago (1999).
5. W. C. Wake, Adhesion and the Formulation of Adhesives, 2nd ed., Applied Science Publishers, London (1982).
6. T. N. Vorob'eva, Polym. Sci., Ser. A Ser. B, 36, 1491 (1994).
7. T. N. Vorobyova, J. Adhes. Sci. Technol., 11, 167 (1997); Q. Dai, J. Zhang, and M. Ma, Appl. Surf. Sci., 72, 67 (1993).
8. T. N. Vorobyova, J. Adhes. Sci. Technol., 11, 167 (1997); Q. Dai, J. Zhang, and M. Ma, Appl. Surf. Sci., 72, 67 (1993).
9. J. Ge, M. P. K. Turunen, and J. K. Kivilahti, Thin Solid Films, 440, 198 (2003).
10. S. Siau, A. Vervaet, E. Schacht, and A. Van Calster, J. Electrochem. Soc., 151, c133 (2004).
11. S. Siau, A. Vervaet, A. Van Calster, I. Swennen, and E. Schacht, Appl. Surf. Sci., 234 (1-4), 457 (2004).
12. S. Siau, A. Vervaet, A. Van Calster, I. Swennen, and E. Schacht, J. Electrochem. Soc., 151, 154 (2004).
13. D. E. Packham, Int. J. Adhes. Adhes., 23, 437 (2003).
14. E. R. Beach, G. W. Tormoen, J. Drelich, and R. Han, J. Colloid Interface Sci., 247, 84 (2002).
15. J. Schultz and M. Nardin, in Adhesion Promotion Techniques, K. L. Mittal and A. Pizzi, Editors, p. 1, Marcel Dekker, New York (1999).
16. E. McCafferty, J. Electrochem. Soc., 150, b342 (2003).
17. J. M. Neirynck, R. J. Gutmann, and S. P. Murarka, J. Electrochem. Soc., 146, 1602 (1999).
18. J. S. Cho, S. Han, K. H. Kim, Y. W. Beag, and S. K. Koh, Thin Solid Films, 445, 332 (2003).
19. E. Dayss, G. Leps, and J. Meinhardt, Surf. Coat. Technol., 116-119, 986 (1999).
20. S. Siau, A. Vervaet, S. Nalines, A. Van Calster, and E. Schacht, J. Electrochem. Soc., 151, C816 (2004).
21. P. B. Weisz, Chem. Technol., 504, (1973).
22. J. S. Sharp and R. A. L. Jones, Phys. Rev. E, 66, 011801 (2002).
23. F. A. Houle, W. D. Hinsberg, and M. I. Sanchez, Macromolecules, 35, 8591 (2002).
24. D. Schröer, R. J. Nichols, and H. Meyer, Electrochim. Acta, 40, 1487 (1995).
25. R. J. Silbey and R. A. Alberty, Physical Chemistry, 3rd ed., par. 17.6, Wiley, New York (1950).
26. C. Y. Wen, Ind. Eng. Chem., 60, 34 (1968).
27. G. F. Froment and K. B. Bischoff, in Chemical Reactor Analysis and Design, 2nd ed., pp. 232-254, Wiley, New York (1990).