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Volumn 495, Issue 1-2, 2006, Pages 348-356
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Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics
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Author keywords
Adhesion; Copper; Epoxy surface modification
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Indexed keywords
ADHESION;
COPPER;
ELECTRODEPOSITION;
EPOXY RESINS;
MICROELECTRONICS;
SYNTHESIS (CHEMICAL);
X RAY PHOTOELECTRON SPECTROSCOPY;
BUILD-UP LAYERS;
EPOXY SURFACE MODIFICATION;
ORGANIC COUPLING AGENTS;
THIN FILMS;
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EID: 28044450422
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2005.08.355 Document Type: Conference Paper |
Times cited : (29)
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References (17)
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