Improved method for determining the shear strength of chip component solder joints

Microelectronics Reliability

Volumn 50, Issue 2, 2010, Pages 235-241

  Krammer, O ^a   Sinkovics, B ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

3D PROFILE; CHIP COMPONENT; DISCRETE SURFACES; IMPROVED METHODS; MAXIMUM STRESS; METALLIZATIONS; MINIMUM ENERGY; PACKAGING ELECTRONIC CIRCUITS; REFLOW--SOLDERING; SHEAR LOADINGS; SHEAR LOADS; SOLDER JOINTS; STANDARD DEVIATION; WETTED AREA;

CHIP SCALE PACKAGES; ELECTRON TUBES; FLIP CHIP DEVICES; SHEAR STRENGTH; STRESS ANALYSIS;

SOLDERING;

EID: 74449083239     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.10.016     Document Type: Article

References (22)

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