The effect of power cycling on the reliability of lead-free surface mount assemblies

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 2, 2001, Pages 241-249

  Davitt, Elaine ^b   Stam, Frank A ^c   Barrett, John ^a,d  

^a IEEE

^b M/A COM   (United States)

^c UNIVERSITY COLLEGE CORK   (Ireland)

^d Department of Chemistry   (Ireland)

Author keywords

Accelerated aging lead free solder joints; Power cycling; Reliability; SnAg3.8Cu0.7 solder

Indexed keywords

AGING OF MATERIALS; CONDITION MONITORING; ELECTRIC RESISTANCE; METALLIZING; MICROSTRUCTURE; RELIABILITY; SOLDERED JOINTS; STRENGTH OF MATERIALS;

POWER CYCLING;

SURFACE MOUNT TECHNOLOGY;

EID: 0035364343     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.926389     Document Type: Article

References (13)

1. Lead-free soldering, an analysis of the current status of lead-free soldering
2. Temperature cycling versus steady state - Another look
3. Can power cycling life of solder joint interconnections be assessed on the basis of temperature cycling tests?
4. Power - Temperature cycle accelerated testing
5. Validity of cyclic tests for assessing the joints in surface mounted assemblies
6. Functional cycles and surface mounting attachment reliability
7. Eftects of power cycling on leadless chip carrier mounting reliability and technology
8. Fatigue life of leadless chip carrier solder joints during power cycling
9. Assessing the joints in surface-mounted assemblies
10. Dwell times
11. Metallurgical considerations for accelerated testing of soft solder joints
12. Mechanical properties of SnAg composite solder joints containing copper-based intermetallics