SCOPUS 정보 검색 플랫폼

Advanced Materials Research

Volumn 76-78, Issue , 2009, Pages 434-439

A novel single step thinning process for extremely thin Si wafers

(5) Tian, Y B a,b Zhou, L a Shimizu, J a Sato, H a Kang, R K b

a IBARAKI UNIVERSITY (Japan)

b DALIAN UNIVERSITY OF TECHNOLOGY (China)

Author keywords

CMG; Grinding; ICGW; Silicon wafer; Thinning

Indexed keywords

CMG; CUP GRINDING WHEEL; CURRENT MANUFACTURING TECHNOLOGIES; DIAMOND SEGMENTS; GRINDING PERFORMANCE; GRINDING PROCESS; KEY TECHNOLOGIES; MECHANICAL GRINDING; SI WAFER; SINGLE-STEP; THINNING PROCESS; WAFER THICKNESS;

ABRASIVES; GRINDING (COMMINUTION); GRINDING (MACHINING); GRINDING MACHINES; GRINDING MILLS; SILICON; SILICON WAFERS; TECHNOLOGY; WHEELS;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 73949088483 PISSN: 10226680 EISSN: None Source Type: Book Series
DOI: 10.4028/www.scientific.net/AMR.76-78.434 Document Type: Conference Paper

Times cited : (9)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.