The microstructure of η′-Cu6Sn5 and its orientation relationships with Cu in the early stage of growth

Thin Solid Films

Volumn 518, Issue 6, 2010, Pages 1667-1674

  Wang, Kuang Kuo ^a   Gan, Dershin ^a   Hsieh, Ker Chang ^a   Chiou, Shi Yung ^b  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

Copper; Cu6Sn5; Interfaces; Tin; Transmission electron microscopy; X ray diffraction

Indexed keywords

CU FILMS; CU FOIL; CU THIN FILM; CU6SN5; ORIENTATION RELATIONSHIP; ROOM TEMPERATURE; SCANNING AND TRANSMISSION ELECTRON MICROSCOPY; STAGE OF GROWTH; THIN-FILM TECHNIQUE; ZONE AXIS;

DIFFRACTION; EPITAXIAL FILMS; METAL CLADDING; MICROSTRUCTURE; SODIUM CHLORIDE; TIN; TITANIUM COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

COPPER;

EID: 73449103583     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.11.080     Document Type: Article

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