Through-silicon via technologies for extreme miniaturized 3D integrated wireless sensor systems (e-CUBES)

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 7-9

  Ramm, Peter ^a   Klumpp, Armin ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER NETWORKS; ELECTRIC CONNECTORS; SILICON; SOLDERING;

3-D INTEGRATION; ICV-SLID; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE;

TECHNOLOGY;

EID: 50949103923     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546909     Document Type: Conference Paper

References (4)

1. P. Ramm, A. Klumpp, 'Method of vertically integrating electronic components by means of back contacting', US Patent 6,548,391
2. http://ecubes.org
3. "Handbook of 3D Integration", edited by P. Garrou, C. Bower and P. Ramm, Wiley-VCH, 2008, ISBN: 978-3-527-32034-9
4. P. Ramm, M. Taklo, J. Weber, J. Wolf, Proc. IMAPS conference, Scottsdale Arizona (2008)