3D stacked MEMS and ICs in a miniaturized sensor node

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2009, Pages 74-77

  Taklo, Maaike M V ^a   Lietaer, Nicolas ^a   Tofteberg, Hannah ^a   Seppänen, Timo ^b   Ramm, Peter ^c   Weber, Werner ^d  

^a SINTEF   (Norway)

^b SensoNor   (Norway)

^c Fraunhofer Institute Reliability and Microintegration   (Germany)

^d INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; INTEGRATED MEMS; MECHANICAL REQUIREMENTS; MICROELECTROMECHANICAL SYSTEMS; STACKING TECHNOLOGY;

INTEGRATED CIRCUITS; MICROELECTROMECHANICAL DEVICES; SENSOR NODES; SENSORS; TELECOMMUNICATION EQUIPMENT; THREE DIMENSIONAL;

MEMS;

EID: 70349193174     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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12. P. Ramm et al., Japanese Journal of Applied Physics, 43 (7A), p. 829.