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Volumn , Issue , 2009, Pages 74-77

3D stacked MEMS and ICs in a miniaturized sensor node

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; INTEGRATED MEMS; MECHANICAL REQUIREMENTS; MICROELECTROMECHANICAL SYSTEMS; STACKING TECHNOLOGY;

EID: 70349193174     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (12)
  • 1
    • 70349228215 scopus 로고    scopus 로고
    • www.ecubes.org
  • 3
    • 84876893379 scopus 로고    scopus 로고
    • MEMS sensor/IC integration for miniaturized TPMS (e-CUBES)
    • SEMATECH, San Diego, California, Sep 25-26
    • Taklo et al., (2008) MEMS Sensor/IC Integration for Miniaturized TPMS (e-CUBES). Manufacturing and reliability challenges for 3D ICs using TSVs, SEMATECH, San Diego, California, Sep 25-26
    • (2008) Manufacturing and Reliability Challenges for 3D ICs Using TSVs
    • Taklo1
  • 4
    • 70349225105 scopus 로고    scopus 로고
    • www.quarzglas-heinrich.de/html/planoptik.html
  • 5
    • 70349219707 scopus 로고    scopus 로고
    • Tuscon, AZ, USA, January 13-17
    • Lin et al, Proceedings of MEMS 2008, Tuscon, AZ, USA, January 13-17, 2008.
    • (2008) Proceedings of MEMS 2008
    • Lin1
  • 6
    • 70349228482 scopus 로고    scopus 로고
    • http://www.schott.com/epackaging/english/auto/others/hermes.html
  • 7
    • 70349228214 scopus 로고    scopus 로고
    • http://www.silexmicrosystems.com/pages/
  • 9
    • 68949217830 scopus 로고    scopus 로고
    • Technologies enabling 3D stacking of MEMS
    • München, Oct 01-02
    • Taklo et al, (2007). Technologies enabling 3D stacking of MEMS. IEEE workshop on 3D System Integration, München, Oct 01-02
    • (2007) IEEE Workshop on 3D System Integration
    • Taklo1
  • 10
    • 70349219495 scopus 로고    scopus 로고
    • www.hymite.com
  • 11
    • 70349222148 scopus 로고    scopus 로고
    • www.kns.com


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.