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Volumn , Issue , 2009, Pages 74-77
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3D stacked MEMS and ICs in a miniaturized sensor node
a
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Author keywords
[No Author keywords available]
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Indexed keywords
3-D INTEGRATION;
INTEGRATED MEMS;
MECHANICAL REQUIREMENTS;
MICROELECTROMECHANICAL SYSTEMS;
STACKING TECHNOLOGY;
INTEGRATED CIRCUITS;
MICROELECTROMECHANICAL DEVICES;
SENSOR NODES;
SENSORS;
TELECOMMUNICATION EQUIPMENT;
THREE DIMENSIONAL;
MEMS;
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EID: 70349193174
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (12)
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